Curved-Slope Carrier Ring for PECVD Edge Defect Reduction

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Solution Overview

Problem

Plasma Enhanced Chemical Vapor Deposition (PECVD) processes often result in edge local defects due to by-products of the deposition reaction accumulating on the carrier ring, which affects semiconductor process yield.

Innovation Solution

A carrier ring design with an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region with a curved slope, where the slope is lower than the wafer surface, preventing by-product accumulation and enabling smooth wafer movement between chambers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a carrier ring is placed around the wafer holder to enable smooth wafer movement, then wafer handling efficiency is improved, but by-products of deposition reaction accumulate on the carrier ring surface causing edge local defects

Engineering Contradiction:

Improvewafer handling efficiencyVSAvoidedge local defects

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies curvature by designing the transition region between the wafer support region and peripheral region with a curved slope instead of a sharp angle. This curved surface prevents by-product accumulation by eliminating crevices where deposits could form, while maintaining the carrier ring's function for smooth wafer movement between chambers

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Ease of manufacture

If the carrier ring surface is flat and level with the wafer, then manufacturing is simplified, but by-products accumulate at the interface between carrier ring and wafer

Engineering Contradiction:

Improvecarrier ring manufacturing simplicityVSAvoiddeposition quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The carrier ring is segmented into distinct functional regions: a wafer support region, a peripheral region, and a transition region connecting them. This segmentation allows each region to be optimized independently - the transition region specifically designed with a curved slope to prevent by-product accumulation, while other regions maintain simple geometries for ease of manufacture

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by giving different geometric characteristics to different regions of the carrier ring. The transition region has a curved slope to prevent by-product accumulation, while the wafer support region and peripheral region maintain simpler geometries. This localized geometric modification addresses the deposition quality issue without complicating the overall manufacturing process

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11795544B2Carrier ring used in a deposition chamber

Publication Date: 2023.10.24 UNITED SEMICONDUCTOR (XIAMEN) CO LTD

AI summary

A chamber for processing deposition on a wafer includes a wafer holder having a central surface region for placing a wafer and a carrier ring support surface encircling the central surface region; and a carrier ring disposed on the carrier ring support surface. The carrier ring comprises an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region comprises a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region comprises a curved slope between the top carrier ring surface and the lower carrier ring surface.