Component Carrier Sealing Structure for Stress Management
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Solution Overview
Problem
Component carriers face challenges in managing mechanical, thermal, and chemical stress during the embedding process, which can damage sensitive components and lead to delamination, especially due to the mismatch in material properties and thermal expansion coefficients between the component and the stack materials.
Innovation Solution
A component carrier with a sealing structure that has a Young's modulus between the insulating layer material and the semiconductor component, incorporating shielding particles for electromagnetic radiation, is used to reduce stress and prevent resin flow, ensuring mechanical robustness and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the component is embedded directly in the stack without a sealing structure, then the manufacturing process is simpler, but stress concentration and delamination occur due to mismatch in material properties
Solution Approach 1:
A sealing structure is introduced as an intermediary layer between the component and the stack. This sealing structure has a Young's modulus value intermediate between that of the component and the stack, acting as a stress buffer that reduces stress concentration and prevents delamination while maintaining manufacturing feasibility
2Strength
If a sealing structure with high Young's modulus is used, then structural strength is improved, but stress mismatch with the component increases leading to cracking
Solution Approach 1:
The Young's modulus of the sealing structure is specifically controlled to be within a defined range (0.5-5 GPa), which is intermediate between the component's Young's modulus (10-100 GPa) and the stack's Young's modulus (0.1-1 GPa). This parameter optimization ensures the sealing structure provides sufficient strength while maintaining stress compatibility to prevent component cracking
3Ease of manufacture
If the sealing structure is made purely from insulating material, then manufacturing is easier, but electromagnetic interference shielding is insufficient
Solution Approach 1:
The sealing structure is constructed as a composite material combining an insulating polymer matrix with conductive shielding particles (such as metal powders or carbon-based materials). The insulating matrix provides mechanical strength and stress buffering, while the conductive particles form a network that shields against electromagnetic interference, achieving both functional requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sealing structure effectively reduces stress and delamination risks, enhances the reliability and longevity of the component carrier by acting as a stress buffer and heat dissipator, while also improving electromagnetic interference shielding.
Implementation Method 1
the value of the Young's modulus of the sealing structure is in between the value of the Young's modulus of material of the at least one electrically insulating layer structure and the value of the Young's modulus of the semiconductor material of the component
Implementation Method 2
the material of the sealing structure comprises shielding particles configured for shielding electromagnetic radiation
Data Source
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AI summary
A component carrier (100) comprising a stack (102) of at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), a component (108) embedded in the stack (102), and a sealing structure (110) sealing at least part of the component (108) with regard to material of the stack (102), wherein the sealing structure (110) is configured for reducing stress between the component (108) and the stack (102).