Carrier Solder Stop Structure for Defined Electrical Connections
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Solution Overview
Problem
Existing carriers for electrical components, such as semiconductor lasers, face challenges in achieving a defined and efficient solder connection, leading to material wastage and uneven solder distribution.
Innovation Solution
The carrier incorporates a solder stop structure that subdivides the contact zone into two regions, restricting solder flow to only one area, allowing for a defined solder layer formation and improved distribution, with the option of applying the solder stop structure as a layer or utilizing the substrate's surface properties, such as silicon or silicon nitride, to prevent unwanted solder flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the contact zone is used as a single uniform region for solder connection, then the electrical and mechanical connection is simple, but the solder distribution is uneven and solder material flows into disadvantageous regions
Solution Approach 1:
The contact zone is divided into multiple regions: a first zone region for solder connection, a second zone region free of solder, and a connecting region. This segmentation is achieved by introducing a solder stop structure that physically separates the contact zone into distinct functional areas, preventing solder from flowing into the second zone region while maintaining electrical connectivity through the connecting region.
2Manufacturing precision
If solder material is allowed to flow freely across the contact zone, then the soldering process is simple, but solder material is wasted and does not form a defined solder layer
Solution Approach 1:
A solder stop structure is introduced as an intermediary element between the first and second zone regions. This solder stop structure acts as a barrier that prevents solder material from flowing into the second zone region, thereby defining the solder layer boundaries and preventing material waste while maintaining a relatively simple soldering process.
3Loss of substance
If the solder stop structure extends over the entire contact zone, then solder flow is completely prevented, but electrical and mechanical connection between zone regions is lost
Solution Approach 1:
The solder stop structure is designed to extend only over a part of the total length of the contact zone, specifically preventing solder flow into the second zone region while leaving the connecting region open. This local application of the solder stop structure maintains electrical connectivity where needed while containing solder material where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a reproducible and efficient solder connection, reducing material usage, preventing solder flow into unintended areas, and allowing for optical verification of the soldering process, thereby enhancing the reliability and longevity of the electrical connections.
Implementation Method 1
With the aid of the solder stop structure, flow of the liquid solder onto the solder stop structure is impeded, or avoided
Data Source
AI summary
A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the substrate, a solder pad disposed on the contact zone, and a solder stop structure disposed laterally next to the solder pad. The solder stop structure has a surface that is less wettable with liquid solder than a surface of the contact zone. The solder stop structure subdivides the contact zone into a first zone region and a second zone region, with the first zone region having the solder pad. The solder stop structure extends over a portion of a total length of the contact zone such that the contact zone has a free connecting region that is free of the solder stop structure. The first and second zone regions are connected to one another by means of the free connecting region.