Carrier Plate Spring Load Distribution for IC Warpage
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Solution Overview
Problem
In electronic devices, excessive heat can cause overheating and performance degradation in semiconductor components, and existing heat dissipation methods may lead to insufficient contact between semiconductor devices and sockets due to warpage, disrupting electrical signal flow.
Innovation Solution
The use of a carrier with torsional springs or leaf springs to distribute loads onto the outer edges and corners of semiconductor devices, counteracting warpage and ensuring adequate contact with sockets, thereby improving signal transmission reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is mechanically coupled to a semiconductor device to dissipate heat, then heat dissipation performance is improved, but contact force between the semiconductor device and socket deteriorates due to warpage
Solution Approach 1:
The patent applies different mechanical properties to different regions of the carrier board. The center region has a first mechanical property (higher flexibility) that allows it to deform and maintain contact force, while the outer regions have a second mechanical property (lower flexibility) that maintains structural stability. This local differentiation resolves the contradiction by allowing the center to compensate for warpage-induced contact loss while the edges maintain overall structure integrity.
Solution Approach 2:
The carrier board is designed with non-uniform mechanical properties that enable dynamic adaptation. When warpage occurs due to thermal expansion or mechanical stress, the center region with higher flexibility can dynamically deform to maintain contact with the socket, while the stiffer outer regions provide structural support. This dynamic response resolves the contradiction between maintaining heat sink contact and preserving socket contact force.
2Reliability
If the semiconductor device is pressed against the socket to improve contact, then signal transmission reliability is improved, but warpage-induced decoupling increases
Solution Approach 1:
The carrier board employs local quality differentiation where the center region has higher flexibility to absorb warpage-induced stresses through controlled deformation, while the outer regions maintain higher stiffness for structural stability. This allows the device to maintain reliable socket contact despite warpage, as the flexible center accommodates dimensional changes without compromising overall structural integrity.
Solution Approach 2:
The non-uniform mechanical property distribution acts as a pre-designed cushioning mechanism. The flexible center region is specifically designed to deform beforehand under thermal or mechanical stress, absorbing the warpage effects before they can cause decoupling from the socket. This preemptive deformation protects the structural stability and maintains reliable electrical contact.
3Ease of manufacture
If uniform mechanical properties are used in the carrier board, then manufacturing simplicity is improved, but load distribution to outer edges deteriorates
Solution Approach 1:
The patent implements local quality variation in the carrier board's mechanical properties. The center region is designed with different mechanical characteristics (higher flexibility) compared to the outer regions (lower flexibility). This non-uniform design optimizes load distribution by directing forces to the outer edges while maintaining manufacturing feasibility through controlled material selection or structural design variations.
4Force
If the carrier board is made more flexible to accommodate warpage, then contact force is improved, but structural stability deteriorates
Solution Approach 1:
The carrier board is designed with spatially varying mechanical properties: the center region has higher flexibility to maintain contact force under warpage conditions, while the outer regions have higher stiffness to preserve structural stability. This local differentiation allows the board to simultaneously achieve both objectives - the flexible center accommodates deformation while the stiff edges maintain overall structural integrity.
Solution Approach 2:
The carrier board is functionally segmented into different regions with distinct mechanical roles. The center portion is optimized for flexibility to maintain socket contact, while the peripheral portions are optimized for structural support. This segmentation allows each region to perform its specific function optimally without compromising the other, resolving the contradiction between flexibility and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances contact force between semiconductor devices and sockets, reducing the likelihood of decoupling and improving signal reliability while reducing manufacturing and repair costs.
Implementation Method 1
The use of a carrier with torsional springs or leaf springs to distribute loads onto the outer edges and corners of semiconductor devices, counteracting warpage
Implementation Method 2
a heatsink is mechanically and thermically coupled to a semiconductor device to dissipate heat therefrom
Data Source
AI summary
Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.