Component Carrier Stack Cavities With Planar RF Interconnects
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Solution Overview
Problem
Existing component carriers face challenges in efficiently managing heat generated by electronic components, maintaining mechanical robustness and electrical reliability, especially under harsh conditions, and minimizing signal distortion and reflection in high-frequency applications.
Innovation Solution
A component carrier is designed with a vertical two-dimensional electrically conductive connection established by connecting two preformed planar electrically conductive surfaces, allowing for a reliable and low-ohmic electric connection without the need for buried vias, thereby avoiding shape restrictions and prepreg-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional buried vias are used to establish vertical electrical connections, then the component carrier can be manufactured with conventional processes, but the manufacturing precision and reliability are degraded due to shape restrictions and prepreg-related issues
Solution Approach 1:
The patent transitions from traditional point-like via connections to planar surface connections, changing the dimensional characteristics of the electrical connection interface. This planar connection approach eliminates the shape restrictions inherent in cylindrical vias and provides a more robust manufacturing process with better precision and reliability.
2Reliability
If high-frequency signals are transmitted through conventional wiring structures, then the component carrier can support standard communication functions, but signal distortion and reflection increase, degrading overall system performance
Solution Approach 1:
The patent modifies the electrical connection structure parameters by transitioning from narrow via channels to broad planar connection surfaces. This parameter change reduces impedance discontinuities and signal reflections, thereby improving high-frequency signal transmission reliability and reducing harmful effects like distortion and reflection.
3Productivity
If electronic components are miniaturized and densely packed to increase functionality, then the component carrier can accommodate more components, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The patent extracts the thermal management function by incorporating through-holes that extend through the component carrier layers. These through-holes serve as thermal pathways that conduct heat away from densely packed components, enabling high component density while effectively managing the resulting heat generation.
Data Source
AI summary
A component carrier includes a first stack having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, and a second stack with at least one second electrically insulating layer structure and at least one second electrically conductive layer structure. The first stack and the second stack are connected with each other so that a vertical two-dimensional electrically conductive connection is established. The first stack has a first cavity and the second stack has a second cavity, the first cavity and the second cavity being separated by at least one further electrically insulating layer structure. At least one of the first cavity and the second cavity is delimited by a wall being at least partially lined with an electrically conductive coating.