Carrier Structure Layout to Prevent Solder Bridging in Electronic Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic packages using surface-mount technology (SMT) face issues with void formation and solder bridging due to the limitations of passive elements, leading to assembly defects and poor appearance.
Innovation Solution
A carrier structure with a substrate body and insulating protective layer featuring slots and fillers that prevent solder bridging by maintaining a distance between bonding pads and intersecting slots, allowing for efficient adhesive filling and solder connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material is filled into the lower space of the passive element, then the passive element is fixed on the substrate, but voids are formed and solder bridging occurs
Solution Approach 1:
The patent divides the bonding pad area into two distinct zones: a first bonding pad area for solder connection and a second bonding pad area for adhesive filling. This segmentation allows the adhesive to be confined to the second area, preventing it from entering the solder reflow area and causing bridging, while still providing effective fixing to the substrate.
Solution Approach 2:
The patent applies different functional properties to different regions of the bonding pad structure. The first bonding pad area is designed with solder-resistant properties and appropriate geometry for solder joint formation, while the second bonding pad area is designed to accept and contain adhesive material. This local differentiation of properties enables both reliable fixing and precise soldering without interference.
2Reliability
If solder paste is applied on bonding pads, then electrical connection is achieved, but solder paste overflows and causes solder bridging
Solution Approach 1:
The bonding pad is segmented into a first bonding pad area reserved exclusively for solder paste application and a second bonding pad area for adhesive filling. The slot structure further segments the space, creating a physical barrier that confines adhesive to its designated area. This multi-level segmentation ensures solder paste remains within boundaries and prevents bridging between adjacent pads.
Solution Approach 2:
The slot structure acts as an intermediary element between the adhesive filling process and the solder paste application process. By providing a dedicated space for adhesive and maintaining a distance from the bonding pad edges, the slot mediates the potential conflict between these two processes, allowing both to proceed without causing defects.
Data Source
AI summary
An electronic package and a carrier structure thereof are provided, in which a filler is formed between a pair of corresponding bonding pads to support an electronic element. The filler includes a first section and a second section. The first section is connected to the bonding pads, the second section intersects with the first section, and the second section is spaced apart from the bonding pads at a distance to avoid electrical bridging problems when the electronic element is electrically connected to the bonding pads via solder material.