Carrier-Substrate Adhesive System for 3D Nanostructure Release
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Solution Overview
Problem
Existing methods for creating three-dimensional nanostructures are not suitable for membranes with compressive stress or disjoint membranes, as they require a carrier system that can efficiently align and release such membranes without damage.
Innovation Solution
A system using a substrate bonded to a carrier with a vaporizable or sublimable bonding agent, such as a glass-like substance, which allows for the processing and alignment of membranes, followed by the release from the carrier through heating or depressurization, enabling the stacking of membranes to form three-dimensional nanostructures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a carrier system with cleavage points is used to align and stack membranes, then membranes can be transported and aligned, but the method is not suitable for membranes with compressive stress or disjoint membranes
Solution Approach 1:
A sacrificial layer is introduced as an intermediary between the membrane and the carrier substrate. This sacrificial layer can be selectively removed (e.g., via oxygen plasma or chemical etching) to release the membrane from the carrier without requiring mechanical cleavage points, thereby enabling the handling of membranes with compressive stress or disjoint configurations that cannot tolerate traditional cleavage-based release mechanisms.
Solution Approach 2:
The bonding between the membrane and carrier is made reversible by changing physical or chemical parameters. The sacrificial layer is designed to be removable under specific conditions (plasma treatment, chemical exposure), allowing the membrane to be released from the carrier after alignment and stacking, thus enabling versatile membrane handling without permanent mechanical attachments.
2Manufacturing precision
If membranes are bonded to a carrier for processing and alignment, then precise alignment can be achieved, but the bonding agent must be removable without damaging the membrane
Solution Approach 1:
The sacrificial layer serves as a mediator that protects the membrane during the release process. By etching or removing the sacrificial layer rather than directly detaching the membrane, the membrane structure is preserved from mechanical stress and damage, achieving both precise alignment and safe release.
Solution Approach 2:
The mechanical cleavage-based release system is replaced with a chemical or plasma-based removal system targeting the sacrificial layer. This substitution eliminates the need for mechanical force during release, thereby preventing membrane damage while maintaining alignment precision achieved during the bonding phase.
3Adaptability or versatility
If a sacrificial layer is used to enable membrane release, then membranes with compressive stress can be handled, but additional processing steps are required
Solution Approach 1:
The sacrificial layer formation is merged with the existing membrane fabrication process. The sacrificial layer is deposited or formed during the same processing sequence as the membrane creation, rather than as a separate additional step, thereby minimizing the increase in process complexity while enabling handling of compressive stress membranes.
Solution Approach 2:
The sacrificial layer is designed to be removed in-line with the membrane stacking process. The removal of the sacrificial layer and the placement of the membrane onto the target substrate are performed in a continuous sequence without interrupting the overall fabrication flow, thereby reducing the perceived complexity despite the additional functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient alignment and stacking of membranes, even those with compressive stress or disjoint portions, by using a permeable carrier that facilitates the release of membranes from the bonding agent, thereby creating robust three-dimensional nanostructures.
Implementation Method 1
the bonding agent is then heated, depressurized or otherwise caused to sublime or vaporize, thereby releasing the processed membrane from the carrier
Implementation Method 2
the bonding agent is then heated, depressurized or otherwise caused to sublime or vaporize, thereby releasing the processed membrane from the carrier
Implementation Method 3
gasses from the bonding agent pass into or through the permeable carrier
Implementation Method 4
The carrier may be permeable. For example, the carrier may have one or more pores through which the bonding agent may escape when heated or otherwise converted to a gas
Data Source
AI summary
A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublime or vaporize, thereby releasing the processed membrane from the carrier.