Carrier-Assisted Substrate Packaging for Smaller Reliable Electronics
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Solution Overview
Problem
Conventional electronic device packages are inadequate, leading to excess cost, decreased reliability, and oversized packages, which hinder efficient manufacturing and performance.
Innovation Solution
A carrier-assisted substrate method for manufacturing electronic devices, involving the use of a redistribution structure with dielectric and conductive layers, solder resist layers, and a carrier for mounting and encapsulating electronic components, followed by carrier removal and interconnection structure formation, to enhance size reduction, cost-effectiveness, reliability, and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic device packages are used, then manufacturing is simpler, but package size becomes too large
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming the redistribution structure on the carrier, mounting electronic components, encapsulating components, and finally removing the carrier. This segmentation allows each stage to be optimized independently, achieving compact final packages while maintaining manageable manufacturing complexity at each step.
Solution Approach 2:
The patent transitions from conventional planar packaging to a three-dimensional structure by building vertical stacks of encapsulated components on the carrier. This dimensional change enables significant reduction in package footprint area while accommodating multiple components and interconnections in the vertical dimension.
2Ease of manufacture
If conventional electronic device packages are used, then manufacturing process is standard, but cost increases
Solution Approach 1:
The carrier is prepared in advance with the redistribution structure formed on its surface before any electronic components are mounted. This preliminary action enables precise positioning and alignment of subsequent components, improving manufacturing efficiency and reducing costs while enhancing overall package reliability through better connection accuracy.
3Reliability
If conventional packaging methods are used, then manufacturing is easier, but reliability decreases
Solution Approach 1:
The encapsulation material is applied beforehand to protect electronic components from environmental damage and mechanical stress. This protective cushioning is integrated into the manufacturing process, shielding components during subsequent handling and assembly operations, thereby improving reliability without proportionally increasing process complexity.
Data Source
AI summary
An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.