Carrier Substrate Fluid Passages for Ultrathin Display Detachment
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Solution Overview
Problem
Conventional methods for fabricating ultrathin display devices face challenges in efficiently detaching the ultrathin array substrate from the carrier substrate due to high temperature bonding, resulting in low detaching efficiency and high defect rates.
Innovation Solution
A carrier substrate with fluid passages and inlets is used, allowing a detaching agent to be dispensed through the passages to contact the adhesive layer, facilitating the detachment of the ultrathin array substrate from the carrier substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive layer bonding is used to attach ultrathin array substrate to carrier substrate, then strong bonding strength is achieved, but detaching efficiency becomes low and defect rates increase
Solution Approach 1:
The adhesive layer is segmented into multiple discrete adhesive patterns rather than a continuous layer. This segmentation allows the detaching agent to access and react with different adhesive regions independently, significantly improving detaching efficiency while maintaining overall bonding strength through the distributed adhesive patterns
Solution Approach 2:
A detaching agent is introduced as an intermediary substance that chemically reacts with the adhesive layer material. This intermediary enables the detachment process by breaking the bond between the ultrathin array substrate and carrier substrate without requiring mechanical force, thus achieving high efficiency detachment while maintaining bonding strength during the attachment phase
2Ease of operation
If detaching agent is applied from four sides of adhesive layer, then detachment process is simplified, but contact surface area between detaching agent and adhesive layer is insufficient
Solution Approach 1:
The detaching agent application transitions from a two-dimensional edge-based approach (applying from four sides) to a three-dimensional infiltration approach. The agent penetrates through openings in the adhesive layer and reaches the adhesive-carrier substrate interface from multiple directions, dramatically increasing the effective contact surface area while maintaining operational simplicity
Solution Approach 2:
The adhesive layer is designed with a porous or patterned structure containing openings that allow the detaching agent to penetrate through the adhesive layer. This porous structure provides direct access to the adhesive-carrier substrate interface, maximizing the contact surface area between the detaching agent and adhesive layer while keeping the process simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the detachment efficiency and reduces defect rates by increasing the contact surface area between the detaching agent and the adhesive layer, ensuring complete detachment of the ultrathin array substrate.
Implementation Method 1
The fluorine-containing detaching agent reacts with the adhesive layer b material, thereby detaching the ultrathin array substrate c (along with the encapsulating substrate d) from the carrier substrate a
Data Source
AI summary
The present application discloses a method of fabricating a display apparatus, comprising providing a carrier substrate comprising a base substrate and an adhesive layer over the base substrate, wherein the base substrate comprises a plurality of fluid passages between the base substrate and the adhesive layer, and a plurality of fluid inlets connected with the plurality of fluid passages; forming a product substrate on a side of the adhesive layer distal to the base substrate; dispensing a detaching agent through the plurality of fluid inlets to the plurality of fluid passages, and contacting the detaching agent with the adhesive layer through the plurality of fluid passages; and detaching the product substrate from the carrier substrate.