Carrier Substrate with Hydrophobic Layer for Thin Glass Detachment
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Solution Overview
Problem
Rigid thin glass substrates used in traditional display device manufacturing are prone to damage due to their thinness, and existing carrier substrates formed of similar materials create strong covalent bonds during high-temperature processes, making it difficult to detach the carrier substrate after manufacturing.
Innovation Solution
A method involving a carrier substrate with a hydrophobic first layer and a second layer, including silicon nitride or transparent metal oxides, bonded to a rigid glass substrate, allowing for easy detachment using a laser beam by preventing covalent bonding and utilizing van der Waals forces for adhesion during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a rigid thin glass substrate is used to manufacture a flat display device, then the display device achieves a thin profile, but the substrate is easily damaged due to its thinness
Solution Approach 1:
The substrate system is segmented into two parts: a thin glass substrate for the display device and a separate carrier substrate. The thin substrate provides the desired thin profile while the carrier substrate provides mechanical strength and damage resistance during manufacturing and handling.
Solution Approach 2:
A carrier substrate acts as an intermediary support structure that temporarily holds the thin glass substrate during manufacturing processes. The carrier substrate provides mechanical support without becoming part of the final display device, enabling the thin substrate to be handled safely.
2Reliability
If a carrier substrate is used to support the rigid thin glass substrate, then the substrate is protected from damage, but the carrier substrate creates strong covalent bonds during high-temperature processes making it difficult to detach
Solution Approach 1:
The carrier substrate is designed with non-uniform local properties: a first layer with hydrophobic surface (preventing covalent bonding) and a second layer with hydrophilic surface (forming strong bonds with the thin glass substrate). This local quality differentiation enables both strong adhesion during manufacturing and easy detachment afterward.
Solution Approach 2:
The carrier substrate is constructed as a composite structure with two distinct layers having different surface properties. The first layer (hydrophobic) prevents covalent bonding with the thin substrate, while the second layer (hydrophilic) provides strong adhesion, creating a material system with dual functionality.
3Strength
If the carrier substrate is formed of similar glass materials, then it provides good mechanical support, but it forms strong covalent bonds during high-temperature processes
Solution Approach 1:
The carrier substrate surface is engineered with local quality variations: the first layer has hydrophobic properties that prevent covalent bonding even at high temperatures, while the second layer has hydrophilic properties that form strong bonds with the glass substrate, allowing controlled adhesion and detachment.
Solution Approach 2:
The surface chemistry parameters of the carrier substrate are changed by creating two distinct layers with different hydrophobicity/hydrophilicity characteristics. This parameter modification allows the same glass material to exhibit different bonding behaviors at different locations and conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the easy detachment of the rigid thin glass substrate from the carrier substrate without damage, preventing failure of the display device and ensuring successful manufacturing processes.
Implementation Method 1
irradiating a laser beam to delaminate the first layer and detaching the rigid thin glass substrate from the rigid glass substrate
Implementation Method 2
irradiating a laser beam to delaminate the first layer
Implementation Method 3
a first layer that is formed on the rigid substrate, has a hydrophobic surface, and is capable of being delaminated by irradiating a laser beam
Implementation Method 4
utilizing van der Waals forces for adhesion during manufacturing
Data Source
AI summary
A method of manufacturing a display device, the method including forming a first layer on a rigid glass substrate, the first layer having a hydrophobic surface; forming a second layer to be bonded to a rigid thin glass substrate on the first layer to prepare a carrier substrate; bonding the rigid thin glass substrate onto the second layer; forming and encapsulating a display portion on an upper surface of the rigid thin glass substrate; and irradiating a laser beam to delaminate the first layer and detaching the rigid thin glass substrate from the rigid glass substrate.