Carrier Substrate Package Structure Preventing Warpage
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Solution Overview
Problem
The existing package structure fabrication methods are complex, costly, and prone to warpage due to the use of multiple carriers and granular encapsulant materials, which affect the integrity and reliability of the package structure.
Innovation Solution
A package structure is developed using a carrier with a recess to house an electronic element, where an insulating layer encapsulates the element, and conductors are formed through the carrier to connect the surfaces, eliminating the need for multiple carriers and simplifying the process, reducing material costs, and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple carriers are used in the fabrication process, then the package structure can be assembled, but the fabrication process becomes complex and material cost increases
Solution Approach 1:
The patent merges the functions of multiple carriers (first carrier for chip mounting, second carrier for circuit structure, third carrier for conductor formation) into a single carrier substrate. This single carrier performs all support functions throughout the fabrication process, eliminating the need for sequential carrier changes and simplifying the overall fabrication process while maintaining package assembly capability.
2Reliability
If the first carrier is removed after encapsulant curing, then the package structure can be completed, but fabrication time and cost increase
Solution Approach 1:
The patent extracts and eliminates the first carrier from the fabrication process entirely by using a single carrier design where the carrier substrate itself serves as the final support structure. This removes the unnecessary step of carrier removal and replacement, directly reducing fabrication time and cost while still achieving complete package structure formation.
3Reliability
If the first carrier is removed, then the package structure can be finalized, but warpage occurs to the encapsulant reducing reliability
Solution Approach 1:
By merging all fabrication functions into a single carrier substrate, the patent eliminates the mechanical stress and structural changes associated with removing and replacing carriers. The encapsulant remains continuously supported on the same carrier throughout the process, preventing warpage and maintaining structural stability while still allowing final package structure completion.
4Reliability
If granular compound material is used for encapsulant, then the package can be formed, but through holes have uneven wall surfaces affecting conductor integrity
Solution Approach 1:
The patent changes the physical state of the encapsulant material from granular compound form to a liquid or paste form that can be deposited and cured to form smooth-walled through holes. This parameter change in material state allows for uniform wall surfaces in the through holes, improving conductor integrity while still achieving complete package formation.
Data Source
AI summary
A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a recess; disposing an electronic element in the recess of the carrier; forming an insulating layer in the recess to encapsulate the electronic element; forming a circuit structure on the carrier, wherein the circuit structure is electrically connected to the electronic element; forming a plurality of through holes penetrating the carrier; and forming a conductive material in the through holes to form a plurality of conductors, wherein the conductors are electrically connected to the circuit structure. By using the carrier as a substrate body, the present invention avoids warping of the package structure.