Carrier Substrate Recess Design for Wafer Stability

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Solution Overview

Problem

Existing carrier solutions are not optimized for reliable support of semiconductor wafers with reinforced wafer edges, leading to instability and potential slipping during handling and processing.

Innovation Solution

A carrier substrate with a recess region and a support surface area is designed to securely receive the frame structure of the substrate, combined with electrostatic or mechanical fixing and adhesive application to enhance support and prevent slipping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional carrier solutions are used, then the structure is simple, but the substrate structure is not reliably supported and may slip during handling

Engineering Contradiction:

Improvesupport reliabilityVSAvoidcarrier structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The carrier substrate is segmented into distinct functional regions: a base portion and a support portion that forms a recess region. This segmentation allows the carrier to provide both structural support and secure retention of the substrate structure, resolving the contradiction between simplicity and reliability by creating specialized zones for different functions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate structure is nested within the recess region of the carrier substrate, with the frame structure fitting into the recess and the process substrate resting on the support surface area. This nesting arrangement ensures reliable support and prevents slipping while maintaining a compact integrated structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If a recess region is added to receive the frame structure, then support reliability improves, but manufacturing complexity increases

Engineering Contradiction:

Improvefixation reliabilityVSAvoidcarrier manufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The recess region and support surface area are pre-formed in the carrier substrate during manufacturing, creating the retention structure in advance. This preliminary action ensures that the substrate structure can be reliably fixed without requiring complex assembly steps or additional components, balancing manufacturing ease with fixation reliability.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If electrostatic or mechanical fixing is applied, then substrate support is enhanced, but device complexity increases

Engineering Contradiction:

Improvesubstrate fixationVSAvoidfixing mechanism complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The carrier substrate's recess region and support surface area are designed to automatically retain the substrate structure through geometric compatibility. The frame structure fits into the recess and the process substrate rests on the support surface, creating a self-fixing mechanism that enhances reliability without requiring complex external fixing devices.

Inventive Principle:

Principle #25Self-service

4Reliability

If a via extending through the base and support portions is added, then negative pressure can be induced for better support, but manufacturing complexity increases

Engineering Contradiction:

Improvesubstrate support stabilityVSAvoidcarrier structure fabrication

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The via is implemented as a separate structural element that penetrates through the base and support portions of the carrier substrate. This segmentation allows the via to function as a dedicated channel for inducing negative pressure, enhancing substrate support stability while keeping the overall manufacturing process manageable through modular fabrication steps.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides stable handling and secure fixation of semiconductor wafers with reinforced edges, preventing slipping and ensuring reliable support during processing, even at high temperatures and in wet-chemical environments.

Implementation Method 1

By providing the via extending through the base portion and the support portion, it is possible to induce a negative pressure for further increasing the support of the substrate structure

Methodology Applied

Scientific EffectNegative pressure: Depressurisation

Implementation Method 2

the carrier substrate comprises a fixing device for electrostatically or mechanically fixing the substrate structure to the carrier substrate

Methodology Applied

Scientific EffectElectrostatic fixing: Electrostatics

Data Source

PatentEP2951860B1Carrier substrate and method for fixing a substrate structure

Publication Date: 2020.03.11 FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV

Figure 1
Figure 2A
Figure 2B~2C

AI summary

A carrier substrate (100) for supporting a substrate structure (200) having a process substrate (210) and a frame structure (220) comprises a base portion (110) and a support portion (120). The support portion (120) is arranged on the base portion (110). The support portion (120) and the base portion (110) form a recess region (130) for receiving the frame structure (220) of the substrate structure (200). The support portion (120) comprises a support surface area (122) for supporting the process substrate (230) of the substrate structure (200).