Carrier Substrate with Metal-Covered Release Layer for Sawing Stability
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Solution Overview
Problem
The challenge in manufacturing semiconductor packages with organic interposers is the abnormal detachment of the release layer from the carrier substrate during the process, which can lead to defects and increased costs due to the difficulty in maintaining flatness and preventing separation during sawing.
Innovation Solution
A carrier substrate design featuring a core layer, unit pattern portions with specific metal layers, and a base metal layer is implemented, where the first and third metal layers cover the release layer's side surfaces, and a second metal layer is added to enhance stability, preventing abnormal separation and ensuring flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a carrier substrate is used for manufacturing semiconductor packages with organic interposers, then large area and cost reduction are achieved, but abnormal detachment of the release layer from the carrier substrate occurs during the process
Solution Approach 1:
The patent segments the monolithic carrier substrate into multiple unit pattern portions, each with its own release layer and metal layer structure. This segmentation allows independent handling and processing of each unit, preventing abnormal detachment by distributing stress and improving adhesion control at each discrete location rather than across a large continuous area.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers including carrier substrate, release layer, first metal layer, second metal layer, and third metal layer. Each layer is made of specific materials with complementary properties that work together to prevent release layer detachment while maintaining the large area benefit of the carrier substrate approach.
2Manufacturing precision
If the carrier substrate is sawed into quad size to improve package process quality, then manufacturing precision is improved, but the carrier may separate during sawing
Solution Approach 1:
The carrier substrate is pre-segmented into multiple unit pattern portions with defined boundaries and separation structures. This pre-segmentation allows the carrier to be cleanly divided into quad size portions during sawing without random separation, as each unit is designed to be processed independently with controlled separation interfaces.
Solution Approach 2:
The patent performs preliminary actions by forming the unit pattern portions, release layers, and metal layer structures on the carrier substrate before the sawing process. This preliminary structuring ensures that when the carrier is subsequently sawed into quad size, the units are already prepared and stable, preventing separation issues during the cutting process.
3Measurement precision
If fine circuit lines are micronized to several micrometers to respond to fine pad pitch, then measurement precision is improved, but maintaining flatness becomes more difficult
Solution Approach 1:
The patent applies local quality by providing specific structural features at the unit pattern portion level, including metal layers and release layers configured to maintain flatness locally at each unit. This local structural control allows fine circuit lines to be micronized with high precision while the overall carrier substrate maintains necessary flatness through distributed local support structures.
Data Source
AI summary
A carrier substrate includes a core layer and at least one unit pattern portion, and the unit pattern portion includes a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, a second metal layer disposed on the release layer, and a third metal layer disposed on the second metal layer and covering side surfaces of the release layer, and a method of manufacturing a semiconductor package using the carrier substrate.