Carrier Support Bars for Substrate Bending Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate carriers fail to prevent deformation and damage of large substrates during transfer, especially in high temperature and pressure environments, due to inadequate support and sudden force application.
Innovation Solution
The carrier incorporates a frame with a through-hole and multiple support bars that are connected to an elastic unit, allowing for movement and preventing deformation, thus maintaining substrate stability and preventing damage from thermal expansion and pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a simple frame structure with a through-hole is used for the carrier, then the device complexity is reduced and ease of manufacture is improved, but the substrate may bend toward the bottom through the hole when the substrate size is large, causing damage
Solution Approach 1:
The support function is segmented from the frame structure by adding separate support bars that extend into the through-hole. These support bars are distinct elements that provide localized support without requiring a complete redesign of the frame structure, thus maintaining manufacturing simplicity while improving substrate support reliability.
Solution Approach 2:
The support bars extend into the third dimension (depth) of the through-hole rather than relying solely on the two-dimensional frame structure. This dimensional extension provides additional support points that prevent substrate bending without adding complex structural elements.
2Reliability
If rigid support bars are used to prevent substrate bending, then substrate support reliability is improved, but the carrier cannot accommodate thermal expansion and sudden forces during transfer, causing substrate damage
Solution Approach 1:
The support bars are designed with dynamic characteristics that allow them to flex and move in response to thermal expansion and sudden forces. This dynamic behavior enables the support structure to adapt to changing conditions while maintaining substrate support, preventing damage from rigid constraints.
Solution Approach 2:
The physical parameters of the support bars (such as their flexibility and movement capability) are optimized to change in response to environmental conditions. This allows the support structure to adjust its characteristics based on thermal expansion and mechanical forces, maintaining reliability while adapting to varying operating conditions.
3Reliability
If multiple support bars are added to prevent substrate bending, then substrate support reliability is improved, but the device complexity increases
Solution Approach 1:
The support function is divided into multiple discrete support bars rather than using a single complex support structure. This segmentation allows each bar to be a simple, easily manufactured element while collectively providing comprehensive substrate support, balancing reliability improvement with minimal increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate bending and damage by providing robust support and accommodating thermal expansion, ensuring safe transfer and processing of substrates in high temperature and pressure conditions.
Implementation Method 1
an elastic unit disposed between a support bar and the frame in order to allow the support bar to move when the support bar is deformed
Data Source
AI summary
A carrier having a plurality of support bars for safely transferring a substrate is provided. The carrier includes a frame having a through-hole formed at a center, the center through-hole including a first inner surface and a second inner surface that faces the first inner surface within in the through-hole; and a plurality of support bars joined to the first inner surface and the second inner surface.