Carrier System for Solar Substrates Minimizing Shadowing
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Solution Overview
Problem
Existing carrier systems for semiconductor wafer substrates in solar cell production suffer from surface inhomogeneities due to fixing means, leading to optical, aesthetic, and electrical property issues, and require frequent cleaning to prevent contamination from deposited material.
Innovation Solution
A carrier system with a heat sink design for substrates, using a carrier element with fixing means that minimizes adjacent substrate areas and ensures thermal management, along with a modular structure and specific adhesive or electrostatic fixing methods to maintain substrate position and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If webs or hook elements are used as fixing means to hold substrates, then substrates can be securely positioned in the carrier system, but the fixing means cover parts of the substrate surfaces leading to inhomogeneities in deposited layers
Solution Approach 1:
The carrier system is divided into multiple independent carrier elements, each capable of holding one or more substrates. This segmentation allows optimization of each element's design to minimize shadowing while maintaining secure substrate positioning through dedicated fixing means on each element.
Solution Approach 2:
The fixing means are designed to be minimally invasive, extracting only the necessary function of holding substrates without excessive material presence. The fixing means are positioned at substrate edges or corners rather than covering central processing areas, removing the harmful shadowing effect while preserving positioning stability.
2Productivity
If carrier systems are reused after processing batches of substrates, then production efficiency is improved, but regular cleaning is necessary to remove deposited material from the carrier system surfaces
Solution Approach 1:
The carrier elements are designed with a simplified structure that accepts disposable or low-cost construction materials. Instead of expensive, complex components requiring meticulous cleaning, the system uses affordable carrier elements that can be easily replaced or quickly cleaned, reducing downtime and maintenance complexity.
Solution Approach 2:
The system enables easy discarding of contaminated carrier elements and recovery of clean ones through simple cleaning processes or replacement. Used carrier elements can be rapidly cleaned or swapped out, allowing continuous production without lengthy cleaning cycles, thus maintaining high productivity while simplifying maintenance.
3Manufacturing precision
If the carrier system structure is simplified to reduce shadowing, then deposited layer uniformity is improved, but the ability to securely hold and position substrates may be compromised
Solution Approach 1:
The carrier elements exhibit local quality by having minimal structure in areas that would cause shadowing (central regions) while concentrating fixing means at specific locations (edges or corners) where substrate holding is critical. This localized approach to structure ensures uniform deposited layers over the substrate surface while maintaining secure positioning through strategically placed fixing elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances substrate processing by minimizing shadowing, maximizing substrate density, extending carrier system lifespan, and reducing process impact, while maintaining uniform substrate positioning and thermal control.
Implementation Method 1
the carrier element (12) is designed together with the fixing means (11) as a heat sink for a substrate (5) fixed to the contact area (10)
Implementation Method 2
specific adhesive or electrostatic fixing methods to maintain substrate position
Implementation Method 3
specific adhesive or electrostatic fixing methods to maintain substrate position
Data Source
Figure 1a~2b
Figure 3a~3c
Figure 4~5c
AI summary
The invention relates to a carrier system (1) for fixing a plurality of substrates (S) to be processed, comprising at least two contact regions (10) with fixing means (11) for fixing a substrate (S) to an associated contact region (10), wherein abutting regions (D) form between two adjoining substrates (S), further comprising a holding device (13) by means of which the carrier system during processing of the substrates (S) can be spatially disposed in a processing system (BA) such that the gravity (g) acting on the substrates (S) has a force component, which points away from the respectively associated contact region (10). According to the invention, the contact regions (10) are configured in the shapes of flat square or rectangular surfaces, an adhesive force acting on the substrate (S) in the direction of the contact region (10) can be applied by the fixing means (11), and the holding device (13) and the fixing means (11) are disposed substantially outside of the abutting regions (D). In this way, the abutting regions (D) between the substrates (S) can be minimized, whereby the carrier system (1) is less exposed to the processing operation. The invention further relates to a method for processing substrates using such a carrier system (1), particularly for the production of semi-conductor wafer solar cells.