Carrier Tape Concave Slots for Small Component Pickup

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Solution Overview

Problem

Existing carrier tapes face challenges in picking up small-sized electronic components, such as those with a 0.6 mm×0.3 mm or smaller dimensions, due to high material costs, adhesion issues with bottom tapes during heat sealing, and difficulty in forming air vent holes for suction, especially when trying to handle components of 0.6 mm×0.3 mm or less in size.

Innovation Solution

A carrier tape with housing holes arranged in the longitudinal direction and featuring concave slots between adjacent holes on the lower surface, which act as air flow paths to facilitate the communication between housing holes, allowing for smoother air flow and easier pickup of small electronic components using a suction nozzle, without the need for deep or large concave slots that could capture components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bottom tape is attached over the entire surface except housing holes through heat sealing, then the electronic components are securely enclosed, but the bottom tape melts and adheres to the housing holes when they are reduced in size

Engineering Contradiction:

Improveenclosure securityVSAvoidadhesion to housing holes

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The bottom tape is segmented into multiple separate attachment regions distributed across the carrier tape surface, rather than forming a continuous layer. This segmentation prevents the tape from melting into and adhering to the housing holes during heat sealing, while still providing secure enclosure through the distributed attachment points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bottom tape attachment is applied selectively to specific local regions (attachment regions) rather than uniformly across the entire surface. This localized attachment approach ensures secure enclosure where needed while avoiding adhesion problems in the housing hole areas.

Inventive Principle:

Principle #3Local quality

2Ease of operation

If air vent opening holes are provided in the bottom surfaces of concave portions, then air passage is improved for suction, but the electronic components may be captured by the opening holes

Engineering Contradiction:

Improvesuction capabilityVSAvoidcomponent capture

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

A groove structure is introduced as an intermediary feature between the housing holes and the bottom tape attachment regions. This groove provides the necessary air passage for suction capability while preventing direct access to the electronic components, thereby avoiding component capture.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If plastic embossed tape is used as package tape, then the electronic components are well protected, but the material cost increases

Engineering Contradiction:

Improvecomponent protectionVSAvoidmaterial cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive plastic embossed tape with a more economical paper-based carrier tape that serves the protective function adequately. The paper carrier tape provides sufficient protection for the electronic components during handling and transport while significantly reducing material costs.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

4Adaptability or versatility

If the housing holes are reduced in size to accommodate smaller electronic components, then the component size compatibility is improved, but the suction capability deteriorates due to lack of air passage

Engineering Contradiction:

Improvecomponent size compatibilityVSAvoidsuction capability

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

The air passage is created by introducing grooves at the bottom surface level, adding a vertical dimension to the air flow path. This allows air to reach the housing holes for suction capability even when the holes are reduced in size for smaller components, effectively solving the problem through dimensional innovation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The concave slots enable stable and efficient air flow through the housing holes, allowing for the smooth pickup of small electronic components, reducing material costs and avoiding adhesion issues, while maintaining a compact design that accommodates smaller component sizes.

Implementation Method 1

concave slots between adjacent holes on the lower surface, which act as air flow paths to facilitate the communication between housing holes

Methodology Applied

Scientific EffectAir flow: Convection

Data Source

PatentUS9538695B2Carrier tape, package tape and series of electronic components

Publication Date: 2017.01.03 MURATA MFG CO LTD

AI summary

A series of electronic components formed using a carrier tape. The carrier tape is adapted to enable smoothly picking up even small-sized electronic components with a suction nozzle. The carrier tape has housing holes housing electronic components therein. The housing holes are arranged in the longitudinal direction. A top tape and a bottom tape are attached to the upper and lower surfaces of the carrier tape. Interval portions between the housing holes are provided with concave slots in their lower surfaces, thereby forming air flow paths. The air flow paths form air passages which enable smoothly picking up the small-sized electronic components using a suction nozzle.