Carrier Tape Partition Wall Design for Peeling Prevention
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Solution Overview
Problem
Existing carrier tapes with paper-based materials experience interlayer peeling at partition walls when the thickness of these walls is reduced, leading to the generation of foreign substances that can damage electronic components during transportation.
Innovation Solution
A carrier tape design featuring a belt-shaped body with laminated layers, where the partition walls have a top surface lower than the front surface, reducing the likelihood of interlayer peeling by maintaining a higher density and hardness, thus preventing debris generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of partition walls is reduced to accommodate more components, then the number of components that can be accommodated increases, but interlayer peeling occurs at the partition walls
Solution Approach 1:
The partition wall is designed with non-uniform thickness, being thicker at the bottom and thinner at the top. This local variation in thickness provides enhanced structural strength at the base where peeling is most likely to occur, while maintaining the overall thin profile needed to accommodate more components. The thicker bottom portion reinforces the partition wall against interlayer peeling during press molding.
Solution Approach 2:
The partition wall structure is pre-designed with a tapered thickness profile before manufacturing. By incorporating the thicker bottom portion in advance during the molding die design, the structure is prepared to resist interlayer peeling during the press molding process, preventing foreign substance generation before it can occur.
2Device complexity
If the thickness of partition walls is reduced to increase component density, then manufacturing complexity decreases, but foreign substance generation increases due to peeling
Solution Approach 1:
Rather than making the entire partition wall uniformly thick (which would increase complexity) or uniformly thin (which would cause peeling), the design incorporates a local thickness variation - thicker at the bottom, thinner at the top. This localized reinforcement prevents peeling and foreign substance generation while keeping the overall structure simple and manufacturable.
3Productivity
If the pitch of accommodating portions is reduced to increase component density, then the number of components per carrier tape increases, but partition wall thickness must be reduced which causes peeling
Solution Approach 1:
The partition wall thickness is varied locally - thicker at the bottom to prevent peeling and maintain integrity, thinner at the top to reduce overall size and allow for smaller pitches. This enables higher component density while preserving partition wall integrity and preventing manufacturing defects.
Data Source
AI summary
A carrier tap has a belt shape and includes material forming layers laminated in a lamination direction, a front surface and a back surface opposed to each other in a height direction corresponding to the lamination direction, and accommodating portions that each accommodate a component. The accommodating portions are each adjacent to the front surface and each aligned along a length direction with a partition wall interposed therebetween. The partition wall includes a top lower in height than a top of the front surface.