Component Carrier Trench Structure for Precision Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component carriers, such as ceramic carriers, face challenges in meeting stringent precision requirements, particularly in terms of perpendicularity of side faces, and their production processes are complex and difficult to simplify.
Innovation Solution
A component carrier assembly with a trench pattern formed on a semiconductor carrier body using dry chemical methods like deep reactive ion etching, which allows for precise formation of trenches and coating of side faces, enabling accurate perpendicular side faces and simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ceramic carriers are used for mounting optoelectronic components, then the components can be mounted and processed further, but it is difficult to meet stringent precision requirements regarding the perpendicularity of side faces
Solution Approach 1:
The patent replaces mechanical machining methods with a chemical etching process to form trenches in the carrier body. This chemical method enables precise perpendicular side faces without the complexity of mechanical precision machining, directly resolving the contradiction between manufacturing precision and ease of manufacture.
Solution Approach 2:
The patent introduces a coating layer as an intermediary that is deposited on the carrier body including the trench side faces. This coating serves multiple functions: it protects the precise trenches during subsequent thinning processes, facilitates electrical contacting, and maintains the perpendicularity of side faces throughout manufacturing, thereby enabling high precision while simplifying the overall production process.
2Manufacturing precision
If complex production processes are used for component carriers, then precision requirements can be met, but the production process becomes difficult to simplify
Solution Approach 1:
The patent combines multiple functions into a single integrated process: the trench formation through chemical etching simultaneously creates the mounting structures, defines component carrier regions, and establishes perpendicular side faces. The subsequent coating step consolidates protection, electrical contacting, and surface preparation into one operation, significantly reducing production process complexity while maintaining high precision.
Solution Approach 2:
The patent performs preliminary formation of precise trenches and application of coating layers before the carrier body is thinned. This sequence ensures that the precision-critical features are established and protected in advance, allowing the thinning process to proceed without compromising the perpendicularity of side faces or requiring additional precision-correcting steps.
3Ease of manufacture
If the carrier body is thinned to allow trench pattern to extend through, then singulation is simplified, but precision must be maintained during thinning
Solution Approach 1:
The patent applies a protective coating layer beforehand that cushions and protects the precise trench structures during the subsequent thinning process. This coating acts as a sacrificial protective layer that prevents damage to the perpendicular side faces and trench geometries, enabling the thinning operation to be performed with less risk to precision while still achieving complete trench penetration for simplified singulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of component carriers with high precision side faces and simplifies the production process, allowing for efficient mounting and electrical contacting of semiconductor components, as well as simplifying the singulation and population of components, while maintaining mechanical stability and precision.
Implementation Method 1
the trench pattern is formed by means of a chemical, in particular dry chemical, method or by means of erosion
Implementation Method 2
A coating is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face of the trench pattern which is coated at least in places
Data Source
AI summary
A component carrier assembly (1) is provided which has a plurality of component carrier regions (10), which are intended for mounting semiconductor components. The component carrier assembly comprises a carrier body (2) with a first major face (21). On the first major face a trench pattern (3) is formed in the carrier body, with first trenches (31) extending parallel to one another in a first direction, the first trenches delimiting the component carrier regions in a second direction extending transversely of the trenches. A coating (4) is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face (5) of the trench pattern which is coated at least in places.