Carrier Wafer Guard Ring for Stable Die Placement

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Solution Overview

Problem

The challenge in semiconductor manufacturing is the unpredictable detachment of dies from the wafer carrier during the dicing and cleaning processes, leading to defects in die placement, particularly in complex three-dimensional packages like System on Integrated Chip (SoIC) and System in Package (SiP), which affects yield and manufacturing efficiency.

Innovation Solution

The implementation of a guard ring around the perimeter of the wafer substrate using an adhesive material to provide consolidation forces, combined with a dielectric layer and carrier wafers, ensures that dies remain securely attached during handling and placement, reducing defects by stabilizing them against air knife cleaning pressures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dies are attached to wafer carrier using conventional adhesive methods, then die placement can proceed, but dies may detach unpredictably during dicing and cleaning processes causing defects

Engineering Contradiction:

Improvedie attachment reliabilityVSAvoiddie detachment defects

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by forming a guard ring structure around the perimeter of the wafer substrate before the dicing and cleaning processes. This guard ring, formed from adhesive material, pre-establishes consolidation forces that will counteract the air knife pressures during cleaning, preventing die detachment before the harmful effect can occur.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The guard ring structure serves as beforehand cushioning by providing a protective adhesive barrier around the wafer perimeter. This structure is prepared in advance to absorb and counteract the detaching forces during cleaning, cushioning the dies against the harmful air knife pressures that would otherwise cause detachment defects.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If guard ring is added around wafer perimeter, then die detachment is prevented, but manufacturing process complexity increases

Engineering Contradiction:

Improvedie placement stabilityVSAvoidwafer carrier structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The guard ring structure performs multiple functions: it provides consolidation forces to prevent die detachment, defines the wafer perimeter, and works integrally with the existing adhesive material already used in the process. By making the guard ring from the same adhesive material used for die attachment, the system achieves multi-functionality without adding fundamentally new process steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies parameter changes by modifying the adhesive material distribution pattern - forming it not only under the dies but also as a continuous guard ring around the perimeter. This changes the spatial parameters of adhesive application, creating a protective boundary that enhances die stability without requiring different materials or fundamentally new process equipment.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If conventional cleaning processes are used, then manufacturing efficiency is maintained, but die detachment causes defects reducing yield

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoiddie placement quality

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The guard ring structure implements preliminary anti-action by pre-establishing consolidating forces that directly counteract the detaching effect of air knife cleaning pressures. This anti-action is built into the structure before cleaning occurs, allowing conventional cleaning processes to proceed at full efficiency while the guard ring prevents the harmful detachment effect.

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively minimizes defects during die placement, enhancing yield and manufacturing efficiency without requiring additional processing steps or masks, by maintaining die integrity throughout the fabrication process.

Implementation Method 1

an adhesive material to form a guard ring around a perimeter of the carrier wafer

Methodology Applied

Scientific EffectAdhesive: Adhesive

Implementation Method 2

stabilizing them against air knife cleaning pressures

Methodology Applied

Scientific EffectAir knife cleaning:

Data Source

PatentUS20260018444A1Methods for reducing defects during die placement

Publication Date: 2026.01.15 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A die transfer system includes a carrier wafer with an adhesive layer on an upper surface of the carrier wafer that comprises a patterned bottom layer and a guard ring over a perimeter of the carrier wafer.