Package Carrier External Wire Loop for IC Stacking
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in package-on-package designs, which require improved yield, low profile, and reliability to meet the demands of portable information and communication devices.
Innovation Solution
The method involves a package carrier with an integrated circuit, an external wire formed in a loop configuration, and an encapsulation with holes exposing the wire and carrier, enabling robust and reliable electrical connections through low-cost manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If package-on-package designs are used to increase packaging density, then the quantity of integrated circuits per unit area increases, but reliability challenges and manufacturing cost increase
Solution Approach 1:
The patent introduces a carrier as an intermediary component between the integrated circuit and the stacking structure. The carrier provides a stable base that simplifies the stacking process and improves reliability by decoupling the IC from direct contact with the stacking interface. This mediator approach allows for better mechanical support and electrical connection management in multi-layer packages.
Solution Approach 2:
The patent segments the packaging system into distinct functional components: the integrated circuit, the carrier, and the stacking structure. This segmentation allows each component to be optimized independently - the carrier can be designed specifically for mechanical support and electrical connections, while the IC focuses on functionality. The segmented approach also simplifies manufacturing and testing processes.
2Reliability
If conventional molding processes are used to encapsulate the integrated circuit, then the IC is protected, but the profile height increases and miniaturization is limited
Solution Approach 1:
The patent uses a mold cavity that replicates the desired final package shape, creating a negative impression that when filled with molding compound produces the exact required geometry. This copying approach allows precise control of the package profile and thickness, enabling miniaturization while maintaining adequate encapsulation protection. The mold cavity design directly determines the final package dimensions.
Solution Approach 2:
The patent changes the physical state and properties of the molding compound during processing - from liquid or semi-liquid state during injection to solidified state after curing. This parameter change allows the material to flow into the mold cavity and conform to the desired low-profile shape, then maintain that shape with structural integrity. The molding compound's transition from fluid to solid enables achieving both low profile and adequate protection.
3Reliability
If wire connections are formed adjacent to the integrated circuit with encapsulation, then electrical connections are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent performs wire bonding or trace formation on the carrier before the encapsulation process. This preliminary action allows electrical connections to be established while the structure is still accessible, and the subsequent encapsulation simply protects these pre-formed connections. This sequence simplifies manufacturing compared to attempting to form connections after encapsulation, as the wiring step can be performed using standard techniques before the compound hardens.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit to the package carrier; forming an external wire on the package carrier and adjacent to the integrated circuit; forming an encapsulation on the package carrier over the external wire; and forming a hole in the encapsulation with the external wire and a portion of the package carrier exposed from the encapsulation.