Electronic Device Case Thermal Dissipation via Connector Plug
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Solution Overview
Problem
Protective cases for electronic devices often compromise heat dissipation efficiency by trapping heat, leading to earlier entry into lower power modes to avoid overheating.
Innovation Solution
Incorporating a heat-spreading component within the case, thermally coupled with a connector plug to efficiently distribute heat across the case, and using thermally conductive materials and flexible circuits to transfer heat away from the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a protective case is added to the electronic device, then device protection is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent combines the protective case structure with an integrated heat dissipation system, merging the protection function and thermal management function into a single unified component. The case includes heat-spreading components and thermally conductive materials embedded within the protective structure itself, allowing simultaneous achievement of protection and heat dissipation.
Solution Approach 2:
The patent introduces thermally conductive intermediary materials and heat-spreading components as mediators between the electronic device and the external environment. These intermediaries facilitate heat transfer from the device through the protective case, enabling the case to act as both a protective barrier and a thermal conduction pathway.
2Temperature
If thermally conductive materials are added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent designs the protective case to serve multiple functions simultaneously: mechanical protection, heat dissipation, and structural support. By making the case itself multi-functional, additional components are minimized, and the same structural elements perform multiple roles, thereby reducing overall system complexity despite adding thermal management capabilities.
Solution Approach 2:
The patent employs composite materials that combine protective properties with thermally conductive properties. By using materials that inherently possess both protection and heat dissipation characteristics, the need for separate protective and thermal management components is reduced, simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, preventing premature entry into lower power modes and maintaining device performance by effectively radiating heat away from the electronic device.
Implementation Method 1
a heat-spreading component embedded within the bottom wall and configured to distribute heat received from the connector plug across the bottom wall
Implementation Method 2
a thermally conductive substrate having a first end in thermally conductive contact with the connector plug and a second end opposite the first end thermally coupled to the heat-spreading component
Implementation Method 3
a flexible circuit extending from the connector plug to the heat-spreading component and from the heat-spreading component to the battery, the flexible circuit configured to transfer heat received at the connector plug to the heat-spreading component
Data Source
AI summary
An electronic device case with a thermal dissipation system is disclosed. The electronic device case is configured to draw heat out of an electronic device disposed therein. The electronic device case includes a connector plug configured to engage a connector receptacle of the electronic device. The thermal dissipation system includes a thermally conductive pathway that both transfers heat to a heat spreader and electrically couples the electronic device to an electrical component within the electronic device case.