Electronic Case Vent Structure for Dust-Blocking Airflow
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Solution Overview
Problem
Existing electronic device cases face a trade-off between maintaining a small heat dissipation hole dimension to prevent dust entry and ensuring adequate airflow efficiency, which affects air intake and venting efficiency.
Innovation Solution
The case incorporates three-dimensionally overlapped first and second blind holes on the outer and inner surfaces, respectively, forming a through region that increases the opening ratio without enlarging the heat dissipation hole dimension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the dimension of the heat dissipation hole is reduced to prevent dust entry, then dust prevention is improved, but the opening ratio decreases and air intake efficiency deteriorates
Solution Approach 1:
The patent transitions from a conventional single-layer through-hole design to a multi-layer blind hole structure where first blind holes on the outer surface and second blind holes on the inner surface are three-dimensionally overlapped. This dimensional transformation allows the through region to extend through the case thickness while maintaining a small projection area on each surface, thereby preventing dust entry while preserving adequate opening ratio for airflow.
2Object-affected harmful factors
If the dimension of the heat dissipation hole is reduced to prevent dust entry, then dust prevention is improved, but air venting efficiency deteriorates
Solution Approach 1:
By forming the through region through three-dimensional overlap of blind holes from both surfaces, the patent creates an extended airflow path through the case thickness. This dimensional approach maintains small surface projections for dust prevention while ensuring sufficient cross-sectional area within the case for effective heat dissipation and air venting.
3Productivity
If the opening ratio is increased to improve air intake efficiency, then air intake efficiency is improved, but the dimension of the heat dissipation hole increases and dust prevention deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: first blind holes on the outer surface, second blind holes on the inner surface, and the through region connecting them. This segmentation allows each component to have a small dimension for dust prevention while the cumulative effect of multiple segments provides sufficient total opening ratio for air intake efficiency.
Solution Approach 2:
The invention resolves the contradiction by moving the opening ratio calculation into the third dimension (case thickness). The through region extends through the case thickness, providing adequate volumetric opening for airflow while maintaining small two-dimensional projections on each surface to prevent dust entry.
Data Source
AI summary
A case for an electronic device is provided. The case includes an outer surface and an inner surface. The outer surface includes a plurality of first blind holes. The inner surface includes a plurality of second blind holes corresponding to the first blind holes. Each first blind hole and the corresponding second blind hole are three-dimensionally overlapped to form a through region extending through the case.