Casing Boss Fixing Mechanism for Thermal Module
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Solution Overview
Problem
Conventional fixing mechanisms for thermal modules in notebook computers require screws and holes on the circuit board, limiting mechanical disposition space and increasing manufacturing costs and assembly time.
Innovation Solution
A fixing mechanism that uses bosses on the casing and resilient components to securely attach the thermal module without screws, allowing the circuit board to remain hole-free and utilize space more efficiently, with the resilient components generating a pressing force to contact the thermal module with the heat source effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional fixing methods with screws and bosses are used, then the thermal module can be securely fixed on the casing, but holes must be formed on the circuit board which reduces mechanical disposition space
Solution Approach 1:
The invention extracts the fixing function from the circuit board by eliminating the need for holes and bosses on the PCB. Instead, the thermal module is directly fixed on the casing using integrating ribs formed on the casing itself, separating the fixing function from the circuit board structure and preserving its mechanical disposition space.
Solution Approach 2:
The invention introduces a cushioning component as an intermediary between the thermal module and the casing. This cushioning component not only facilitates the fixing process but also provides thermal conduction and shock absorption functions, simplifying the overall fixing mechanism while maintaining secure attachment.
2Reliability
If screws and bosses are used for fixing, then the thermal module can be securely attached, but manufacturing cost and assembly time increase
Solution Approach 1:
The invention employs self-clamping ribs that automatically clamp the thermal module when the cases are assembled. The resilient nature of these ribs provides self-adjusting clamping force without requiring additional fastening operations, enabling quick assembly while ensuring reliable fixation.
Solution Approach 2:
The invention merges multiple functions into the cushioning component: it serves as a fixing element, thermal conductor, and shock absorber simultaneously. This consolidation eliminates the need for separate fixing components like screws and bosses, reducing assembly steps while maintaining secure attachment.
3Area of stationary object
If holes are formed on the circuit board for boss assembly, then the fixing component can be secured, but the circuit board has less disposition space for circuit arrangement
Solution Approach 1:
The invention extracts the fixing function entirely from the circuit board by eliminating holes and bosses on the PCB. The thermal module is fixed on the casing structure itself, preserving the circuit board's integrity and maximizing its available space for circuit arrangement while maintaining fixing strength through the casing's integrating ribs.
Solution Approach 2:
The cushioning component acts as an intermediary that transfers the fixing load from the thermal module to the casing structure, bypassing the need for direct attachment to the circuit board. This preserves the circuit board's mechanical disposition space while ensuring adequate fixing strength through the resilient clamping action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and assembly time by eliminating the need for screws and holes, while providing effective heat dissipation and vibration absorption, thus optimizing the use of internal space for circuit arrangement.
Implementation Method 1
the resilient component generates a resilient recovering force to press the electronic component on the heat source of the circuit board
Implementation Method 2
the boss pierces through a hole on the electronic component to constrain a movement of the electronic component
Implementation Method 3
the electronic component is a thermal module for dissipating heat generated from a heat source of the circuit board
Data Source
AI summary
A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located between the first casing and the electronic component, a circuit board putting on the electronic component and fixed on the first casing, and a second casing pressing the circuit board and fixed on the first casing. The circuit board contacts against the electronic component tightly by an assembly of the first casing and the second casing.