Casing Structure Coplanar Junction for Reliable Conductive Layer Connection
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Solution Overview
Problem
The existing methods for connecting metal components to large-area conductive layers in plastic casings are unreliable due to weak or inaccurate adhesion of conductive tapes, often caused by non-coplanar junctions between metal and plastic components, leading to potential disconnection.
Innovation Solution
A casing structure and manufacturing method where the plastic casing covers the side surface of the metal component, forming a coplanar junction, allowing the conductive layer to extend from the metal component to the plastic casing, eliminating the need for conductive tapes and ensuring reliable connection by using an in-mold injection process for the plastic casing and sputtering for the conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive tapes are used to connect metal components to conductive layers, then the connection can be established, but the adhesion is weak or inaccurate due to human errors and non-coplanar junctions
Solution Approach 1:
The patent merges the metal component and plastic casing into a coplanar integrated structure, eliminating the height difference that caused adhesion problems. The metal component is embedded in the plastic casing such that their top surfaces are flush, allowing the conductive layer to form a continuous, reliable connection across both materials without requiring separate adhesive tapes.
Solution Approach 2:
The plastic casing acts as an intermediary that bridges the metal component and the conductive layer. By forming the plastic casing to cover the metal component and create a coplanar surface, the plastic serves as a mediator that enables direct, accurate adhesion of the conductive layer without human error in tape placement.
2Ease of manufacture
If the junction between metal components and plastic casings is not coplanar, then the metal components can be connected to the plastic casing, but the conductive layers are likely to be disconnected at the junction
Solution Approach 1:
The patent applies the principle of equipotentiality by creating a coplanar junction between the metal component and plastic casing, where both surfaces are at the same level. This eliminates the height difference that caused conductive layer disconnection, ensuring a continuous, reliable conductive path across the entire surface without interruption.
3Ease of manufacture
If conductive tapes are used for connection, then the metal components can be connected to conductive layers, but human errors cause weak or inaccurate adhesion
Solution Approach 1:
The patent implements self-service by designing the plastic casing to automatically provide a coplanar mounting surface for the metal component. The casing structure itself creates the precise alignment and flush surface needed for accurate conductive layer adhesion, eliminating the need for manual tape placement and removing human error from the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a robust and reliable connection of metal components to large-area conductive layers, enhancing electro-magnetic compatibility (EMC) by preventing disconnection due to structural height differences and reducing human error-related adhesion issues.
Implementation Method 1
the step of forming the plastic casing includes an in-mold injection process
Implementation Method 2
the step of forming the conductive layer includes a sputtering process
Data Source
AI summary
A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.