Electronic Assembly Casing with Integrated Heat Sink Cage
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Solution Overview
Problem
Conventional PC cases with fans fail to meet physical security requirements for slot machines due to inadequate heat dissipation and increased power consumption, which generates excessive heat.
Innovation Solution
An electronic assembly casing made from non-heat-conducting materials like transparent plastics, featuring a heat sink cage integrated into the casing walls with a trench system for airflow and a coupling member for secure attachment to the circuit board, allowing for effective heat dissipation while preventing physical access to electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional PC cases with fans are used for heat dissipation, then heat can be dispersed, but physical security requirements are not met and unauthorized access is possible
Solution Approach 1:
The casing is segmented into distinct functional zones: a sealed secure enclosure for the logic box and circuit board, and a separate heat dissipation structure with controlled airflow paths. This segmentation allows heat management without compromising security, as the heat sink and ventilation channels are designed to dissipate thermal energy while maintaining physical barriers around sensitive electronic components.
Solution Approach 2:
A heat sink acts as an intermediary thermal management component that interfaces with the circuit board to conduct heat away from sensitive electronics. The heat sink is positioned and designed to provide thermal coupling for heat dissipation while being part of the sealed enclosure structure, thus mediating between the need for cooling and the requirement for physical security.
2Productivity
If PC standard architecture is adopted to improve performance, then gaming performance is improved, but power consumption increases and generates more heat
Solution Approach 1:
The design converts the harmful effect of increased heat generation from high-performance PC architecture into a managed thermal flow pattern. The heat dissipation structure is designed to channel and control airflow, transforming the thermal byproduct of high-performance computing into a directed thermal management system that maintains cooling efficiency without requiring additional active cooling components that would further increase power consumption.
3Temperature
If conventional PC cases are used, then heat dissipation is achieved, but security against tampering and physical attacks is compromised
Solution Approach 1:
The secure enclosure and heat dissipation functions are merged into a single integrated casing structure. The heat sink is incorporated as part of the sealed enclosure, and ventilation channels are designed within the secure housing itself. This merging eliminates the need for separate access points or openings that would compromise security, as thermal management is achieved through integrated design features rather than external cooling components requiring physical access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a secure and efficient heat dissipation system that maintains the integrity of the electronic components by allowing airflow around the heat sink while preventing unauthorized access, addressing both security and thermal management issues in gaming machines.
Implementation Method 1
heat dissipation system that allows airflow around the heat sink
Implementation Method 2
heat sink that extends from the circuit board into the heat sink cage
Implementation Method 3
The coupling member may include an adhesive to adhere the heat sink cage to the circuit board about said perimeter
Data Source
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AI summary
An electronic assembly casing is disclosed. The casing has walls providing an internal chamber and a circuit board mount to mount a circuit board in the internal chamber. The casing further comprises a heat sink cage in one of the walls to accommodate a heat sink of the circuit board when mounted on the circuit board mount.