Integrated Casing Liquid Cooling with Flow Channels
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Solution Overview
Problem
Conventional liquid-cooling heat dissipating systems are cumbersome, inefficient, and noisy due to separate components and the need for additional fans, which limits heat dissipation effectiveness and user comfort.
Innovation Solution
A liquid-cooling heat dissipating device integrated into a casing with a liquid flow channel and heat dissipating fin, featuring a cold and hot connector system connected by pipelines, where a pump at the water tank enhances liquid flow, allowing for efficient heat transfer and dissipation without external fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate water-cooling connector, water pump, cooling base and water tank are used, then heat dissipation function is achieved, but device complexity increases and spatial arrangement becomes inconvenient
Solution Approach 1:
The patent combines the water tank and cooling base into a single integrated unit, eliminating the need for separate water-cooling connectors and reducing the number of components. The casing itself serves as the heat dissipation structure with integrated liquid flow channels, merging multiple functions into one unified device that maintains effective heat dissipation while reducing complexity.
Solution Approach 2:
The casing is designed to serve multiple functions: it provides structural enclosure for the computer components and simultaneously acts as the cooling base with integrated liquid flow channels and heat dissipation fins. This multi-functionality eliminates the need for separate cooling components and simplifies the overall system architecture.
2Reliability
If the cooling base area is increased for better heat dissipation, then heat dissipation efficiency improves, but spatial arrangement becomes inconvenient and requires additional fans
Solution Approach 1:
The patent extends heat dissipation from a two-dimensional base surface to a three-dimensional structure by adding vertical fins that extend upward from the cooling base. This dimensional transition increases the heat dissipation surface area without expanding the horizontal footprint, allowing efficient heat dissipation within the confined spatial constraints of the computer case.
3Reliability
If a fan is installed for heat dissipation, then heat dissipation capability is enhanced, but noise increases and user comfort decreases
Solution Approach 1:
The patent replaces the mechanical fan-based forced convection system with a liquid cooling system that uses fluid circulation and thermal conduction. The liquid absorbs heat from the CPU through the water tank and dissipates it through the fins, eliminating the need for rotating mechanical parts and significantly reducing noise generation while maintaining effective heat dissipation capability.
4Temperature
If system fan is used at high frequency for long time, then system temperature can be lowered, but noise is produced and execution speed decreases
Solution Approach 1:
The liquid cooling system operates continuously with the liquid constantly circulating through the water tank and cooling base, providing uninterrupted heat dissipation without the need for high-frequency fan operation. The pump-driven liquid circulation maintains steady-state cooling, lowering system temperature sustainably without producing noise or reducing execution speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design improves heat dissipation efficiency, reduces noise, and maintains stable operation of electronic equipment by continuously cycling heated liquid through the casing's heat dissipating fins and back to the water tank, effectively managing heat without external fans.
Implementation Method 1
the pipeline sends the heated liquid to the liquid flow channel on the wall of the casing
Implementation Method 2
the heat dissipating fin on the casing dissipates the heat to the outside
Implementation Method 3
installs a pump at the water tank for expediting the liquid flow
Data Source
AI summary
A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing. The casing includes a panel having a cold connector and a hot connector. The cold connector is connected to a water tank and the hot connector is connected to the liquid flow channel. Another end of the connectors are connected to a water-cooling connector through a pipeline, and the water-cooling connector is installed at a heat source, such that the pipeline sends heated liquid to the liquid flow channel on the wall of the casing, and the heat dissipating fin on the casing dissipates the heat to the outside, and the cooled liquid is returned to the water tank and sent to the water-cooling connector on the heat source by the pipeline for repeated cycles.