Electronic Casing with Shielding and Waterproof Layers
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Solution Overview
Problem
Metal alloy casings used in electronic products are prone to moisture and corrosion, necessitating an effective protection design to prevent such issues while maintaining structural strength and aesthetics.
Innovation Solution
A casing design incorporating a substrate with a protective layer, conductive shielding components, and waterproof layers, where the protective layer encapsulates the substrate surfaces, and conductive shielding components cover openings to block external moisture, with waterproof layers securing the components to enhance bonding strength and prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal alloy casings are used to meet design requirements for thin and light electronic products with excellent structural strength, then structural strength and thin-light design are improved, but the casings become easily moisten or corroded
Solution Approach 1:
The patent applies composite materials by combining metal alloy substrate with multiple protective layers including protective coating layers and waterproof layers. This creates a composite structure that maintains the structural strength of metal alloy while adding corrosion and moisture resistance through the layered protective system.
Solution Approach 2:
The protective system is segmented into multiple functional layers: protective coating layers applied on the protective layer, waterproof layers covering edges and openings, and sealing structures. This segmentation allows each layer to perform its specific function optimally while collectively providing comprehensive protection against moisture and corrosion.
2Object-affected harmful factors
If protective layers and waterproof components are added to prevent moisture and corrosion, then anti-corrosion effect is improved, but device complexity increases
Solution Approach 1:
The protective layers and waterproof components are designed to serve multiple functions simultaneously. The waterproof layers not only prevent moisture ingress but also provide sealing and adhesion functions. The protective coating layers provide both corrosion protection and surface finish. This multi-functionality reduces the need for separate components, thereby managing complexity while maintaining effective protection.
Solution Approach 2:
The patent utilizes thin film protective layers and waterproof coatings that can conform to complex casing geometries without requiring complex structural modifications. These flexible thin layers provide effective protection while adding minimal complexity to the overall device structure.
Data Source
AI summary
A casing includes a substrate, a protective layer, a plurality of conductive shielding components and a plurality of waterproof layers. The substrate has a first surface and a second surface. The protective layer encapsulates the first surface and the second surface, wherein the protective layer has a plurality of openings and a part of the first surface is exposed from the openings. The conductive shielding components contact the protective layer encapsulating the first surface, and the conductive shielding components respectively cover the openings. The waterproof layers respectively cover edges of the conductive shielding components and contact the protective layer. A manufacturing method of casing is also provided.