Catalyst Ink for 3D Conductive Constructs
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Solution Overview
Problem
Current deposition processes for metallic compounds in arbitrary three-dimensional geometries fail to achieve conductivity comparable to bulk metal, with ink or aerosol-based precursors only providing 30% of the conductivity of their bulk material counterparts.
Innovation Solution
A colloidal solution of palladium nanoparticles and a solvent is used as a catalyst ink, applied via aerosol jet printing, followed by electro-less plating to deposit metal, allowing for the formation of conductive three-dimensional constructs with desired shapes and sizes, including microelectronic circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If ink or aerosol based precursors are used for deposition, then arbitrary three-dimensional geometries can be achieved, but conductivity is only 30% of bulk material
Solution Approach 1:
The patent uses a binder as an intermediary substance to hold metallic particles together in the deposited layer. The binder enables the ink or aerosol precursor to form a coherent structure that maintains electrical conductivity while being deposited in arbitrary three-dimensional geometries, resolving the contradiction between geometric flexibility and conductivity reliability.
2Ease of manufacture
If current ink or aerosol precursors are used, then deposition in complex shapes is possible, but the conductivity performance deteriorates
Solution Approach 1:
The patent changes the parameters of the precursor composition by incorporating specific binder materials and adjusting the metallic particle concentration and size distribution. These parameter changes enable the deposition process to maintain high conductivity performance while achieving complex three-dimensional shapes, resolving the contradiction between manufacturing ease and conductivity performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves conductivity on par with bulk metal, enabling the creation of flexible sensors and transistors with conductive patterns, surpassing the limitations of existing technologies by providing conductive layers in complex geometries.
Implementation Method 1
The substrate may be subjected to electro-less plating to plate the deposited nanoparticles with metal
Implementation Method 2
The substrate may be subjected to electro-less plating to plate the deposited nanoparticles with metal
Implementation Method 3
The catalytic ink may be applied onto a substrate using aerosol jet printing
Implementation Method 4
The catalytic ink may be applied onto a substrate using aerosol jet printing
Data Source
AI summary
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.