Catalyst Layer Formation With Needle Projections for Low Noble Metal Use

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Solution Overview

Problem

Noble metals used as catalytic metals are expensive and require a large specific surface area to enhance their efficiency, necessitating a method to increase the surface area without significantly increasing the amount of metal used.

Innovation Solution

A method involving displacement plating and etching on a semiconductor substrate with projections to form a multi-layer catalyst layer with needle-shaped projections, increasing the surface area of the catalytic metal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the amount of noble metal is increased to enhance catalytic performance, then the catalytic efficiency is improved, but the cost increases significantly

Engineering Contradiction:
Improvecatalytic performanceVSAvoidamount of noble metal
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent transforms the catalyst structure from a flat two-dimensional layer to a three-dimensional hierarchical structure with vertical needle-like projections. This dimensional change increases the surface area available for catalytic reactions without proportionally increasing the metal quantity, as the volume remains constrained while the surface area expands through vertical growth

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The catalyst layer incorporates a porous structure with controlled void spaces between the needle-like projections. This porosity increases the effective surface area accessible to reactants while maintaining a lower metal loading, allowing efficient mass transport and catalytic activity with reduced noble metal consumption

Inventive Principle:
Principle #31Porous materials

2Reliability

If the surface area of catalytic metal is increased to improve efficiency, then the catalytic performance is enhanced, but the complexity of the manufacturing process increases

Engineering Contradiction:
Improvecatalytic efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs self-organized growth mechanisms where the catalyst structures form hierarchical needle-like projections through controlled chemical processes. The system self-assembles the complex 3D morphology without requiring manual intervention or complex equipment, reducing manufacturing complexity while achieving high surface area

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent controls the morphology and surface area by adjusting process parameters such as precursor concentration, deposition time, and temperature during catalyst formation. By varying these parameters, the desired hierarchical structure is achieved through simple process control rather than complex manufacturing steps

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively enhances the surface area of the catalytic metal, allowing for efficient deposition and utilization of noble metals, thereby reducing costs and improving catalytic performance.

Implementation Method 1

performing displacement plating on a substrate comprising a surface that is made of a semiconductor and comprises a plurality of projections, thereby depositing a catalytic metal at positions of the plurality of projections

Methodology Applied
Scientific EffectDisplacement plating: Electroplating

Data Source

PatentUS12605701B2Method of forming catalyst layer
Publication Date: 2026.04.21 KK TOSHIBA
  • US12605701B2 patent drawing
  • US12605701B2 patent drawing
  • US12605701B2 patent drawing

AI summary

According to an embodiment, a method of forming a catalyst layer includes performing displacement plating on a substrate having a surface that is made of a semiconductor and includes a plurality of projections, thereby depositing a catalytic metal at positions of the plurality of projections.