Catalyst Layer Formation on Substrate Recesses
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Solution Overview
Problem
In the manufacturing of semiconductor devices, the existing methods for forming a catalyst layer on substrates with recesses often result in insufficient adhesivity of the catalyst on the surface, leading to peeling off of the plating layer and adverse effects from residual catalyst solution within the recesses, which affects the characteristics of the wiring substrate.
Innovation Solution
A method and system for forming a catalyst layer that involves supplying a catalyst solution onto the substrate to adsorb the catalyst onto both the surface and inner surface of the recess, followed by rinsing and drying, and then using a binder solution to securely bind the catalyst to the surface, ensuring no residues remain within the recess.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the catalyst solution is supplied onto the substrate to adsorb the catalyst onto the surface and into the recess, then the catalyst layer is formed, but the adhesivity of the catalyst on the surface may be insufficient causing the plating layer to peel off
Solution Approach 1:
The patent divides the catalyst application process into two distinct stages: first forming a catalyst layer by adsorption, then applying a binder solution to secure it. This segmentation allows each stage to optimize for its specific function - maximum catalyst uptake followed by reliable adhesion.
Solution Approach 2:
The binder solution is applied after the catalyst layer is already formed through adsorption. This preliminary formation of the catalyst layer ensures maximum catalyst uptake, and then the binder is applied as a subsequent action to secure it, preventing peeling during subsequent processing.
2Quantity of substance
If the catalyst solution is supplied onto the substrate to adsorb the catalyst onto the surface and into the recess, then the catalyst layer is formed, but the catalyst solution may remain within the recess causing adverse effects upon the characteristic of the entire structure
Solution Approach 1:
The patent extracts and removes the harmful element (catalyst solution residues) from the recess after the catalyst has been adsorbed. By separating the useful function (catalyst adsorption) from the harmful residue, the process achieves high catalyst uptake without compromising device characteristics.
Solution Approach 2:
The patent converts the potential harm of catalyst solution residues into a benefit by using the recess structure to concentrate and retain the catalyst during adsorption, then subsequently removing the liquid residues. The recess serves first to enhance catalyst uptake, then to be cleaned of harmful residues.
3Quantity of substance
If the catalyst is adsorbed onto the surface of the substrate by supplying the catalyst solution, then the catalyst layer is formed, but the adhesivity of the catalyst on the surface may be insufficient
Solution Approach 1:
The binder solution acts as an intermediary substance between the catalyst layer and the substrate. It mediates the adhesion process by chemically or physically bonding to both the catalyst particles and the substrate surface, creating a strong interface that prevents peeling during subsequent plating and processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach securely adsorbs the catalyst onto the substrate surface without leaving residues in the recess, enhancing the adhesivity and preventing peeling of the plating layer, thereby improving the structural characteristics of the wiring substrate.
Implementation Method 1
forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to adsorb the catalyst onto a surface of the substrate and onto an inner surface of the recess
Implementation Method 2
rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate
Implementation Method 3
drying the surface of the substrate and the inside of the recess
Implementation Method 4
binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate
Data Source
AI summary
A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2a to adsorb the catalyst 22A onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate 2 and an inside of the recess 2a by supplying a rinse liquid; drying the surface of the substrate 2 and the inside of the recess 2a. Further, by supplying a binder solution 34 containing a binder 22B onto the substrate 2, the catalyst 22A on the surface of the substrate 2 is bound to the substrate 2 by the binder 22B.