Catalyst Layer Formation on Substrate Recesses
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Solution Overview
Problem
Current methods face challenges in uniformly adsorbing a catalyst onto the entire surface of a substrate, particularly in forming a catalyst layer for semiconductor devices like multilayer wiring substrates, which affects the formation of conductive barrier films and electrical connections.
Innovation Solution
A catalyst layer forming method and system that involves preparing a substrate with a recess, uniformly diffusing a catalyst liquid across the substrate's surface, and rotating the substrate to ensure even adsorption on both the surface and inner recess surfaces, using a substrate holding/rotating device and supply units to achieve comprehensive catalyst layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a catalyst liquid is supplied onto a substrate to form a catalyst layer, then a catalyst layer can be formed on the substrate surface, but it is difficult to uniformly adsorb the catalyst to the entire surface of the substrate including recesses
Solution Approach 1:
The catalyst supply process is segmented into two distinct stages: first supplying catalyst liquid to the upper surface of the substrate, then rotating the substrate to supply catalyst liquid to the recess inner surfaces. This segmentation allows each stage to target specific areas, achieving uniform catalyst adsorption across the entire substrate including recesses.
Solution Approach 2:
The substrate is rotated during the catalyst supply process to dynamically change the orientation and exposure of different substrate surfaces to the catalyst liquid. This dynamic rotation ensures that catalyst liquid can access and adsorb uniformly onto both upper surfaces and recess inner surfaces that would otherwise be difficult to reach.
2Manufacturing precision
If the substrate is rotated during catalyst supply, then uniform adsorption on recess inner surfaces is achieved, but the processing time increases
Solution Approach 1:
The catalyst supply process uses periodic action by rotating the substrate in a controlled manner during catalyst liquid supply. The rotation is performed only during the catalyst supply phase, creating a periodic motion that ensures uniform distribution without extending the overall processing time excessively.
3Area of stationary object
If catalyst liquid is supplied to ensure wide diffusion, then catalyst can reach entire substrate surface, but controlling uniform adsorption becomes more difficult
Solution Approach 1:
Rotating the substrate during catalyst liquid supply creates dynamic flow patterns that promote wide diffusion of catalyst liquid across the substrate surface while maintaining uniform adsorption. The rotation ensures catalyst liquid reaches all areas including recesses without creating localized concentration variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the uniform adsorption of catalysts across the entire substrate surface and inner recess surfaces, enhancing the formation of catalyst layers and improving the quality of conductive barrier films, thereby supporting higher density semiconductor devices and efficient electrical connections.
Implementation Method 1
supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is widely diffused to an entire surface of the substrate
Implementation Method 2
uniformly adsorbing the catalyst to the entire surface of the substrate
Implementation Method 3
supplying the catalyst liquid to a central portion of the substrate while rotating the substrate and by adsorbing the catalyst to an entire inner surface of the recess
Data Source
AI summary
A catalyst layer can be uniformly formed on an entire surface of a substrate and an entire inner surface of a recess. A catalyst layer forming method of forming the catalyst layer on the substrate includes a first supply processing of forming a substrate surface catalyst layer 22A by supplying a catalyst liquid on the entire surface of the substrate 2; and a second supply processing of forming a recess inner surface catalyst layer 22B by supplying the catalyst liquid to a central portion of the substrate 2 while rotating the substrate 2.