Catalytic Ink Copper Patterning for Transparent Antimicrobial Surfaces
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Solution Overview
Problem
Existing antimicrobial technologies face challenges in providing cost-effective, environmentally friendly, and adaptable solutions for frequently touched surfaces that are effective against infectious agents without using copper nanoparticles and complex processes like sputtering or sintering, while maintaining high light transmittance and avoiding electrical conductivity issues.
Innovation Solution
The development of antimicrobial articles with a non-electrically conductive substrate featuring a catalytic ink pattern and electrolessly plated copper metal, applied through flexographic printing and electroless plating, which forms a pattern of copper metal features that inhibit microbial growth without electrical conductivity, allowing high light transmittance and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles are used for antimicrobial activity, then antimicrobial effectiveness is improved, but environmental harm and manufacturing complexity increase
Solution Approach 1:
The patent changes the physical form of copper from nanoparticles to macroscopic metal features (flakes, foil, wire, mesh) that can be visually detected. This parameter change maintains antimicrobial effectiveness while eliminating the environmental and health concerns associated with nanoparticle use, as the larger particles do not pose the same inhalation or ingestion risks
Solution Approach 2:
The patent employs disposable antimicrobial articles that can be applied to surfaces and replaced periodically. This approach using inexpensive copper-containing articles eliminates the need for complex nanoparticle synthesis and disposal systems, reducing environmental impact while maintaining effective antimicrobial protection
2Reliability
If sputtering or sintering processes are used to apply copper, then antimicrobial coating is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces complex vacuum sputtering equipment with simple mechanical application methods such as adhesives, tapes, or direct attachment of copper-containing materials. This substitution maintains antimicrobial coating effectiveness while dramatically reducing manufacturing complexity and equipment requirements
Solution Approach 2:
The patent pre-forms copper-containing antimicrobial materials (flakes, foil, wire, mesh) into ready-to-apply configurations before attachment to the substrate. This preliminary preparation eliminates the need for complex in-situ deposition processes like sputtering or sintering, simplifying manufacturing while ensuring effective antimicrobial coverage
3Reliability
If continuous copper metal coating is applied, then antimicrobial coverage is improved, but electrical conductivity increases causing interference issues
Solution Approach 1:
The patent divides continuous copper metal coating into discrete, separated features (flakes, particles, or patterned deposits) that are distributed across the substrate surface. This segmentation maintains comprehensive antimicrobial coverage while breaking electrical continuity, eliminating conductivity interference with electronic devices
Solution Approach 2:
The patent creates localized copper metal features with specific spatial distribution and spacing. Each local feature provides antimicrobial activity, while the overall pattern ensures no continuous conductive path forms. This local quality approach allows high antimicrobial coverage while maintaining electrical insulation properties
4Reliability
If opaque antimicrobial materials are used, then antimicrobial effectiveness is improved, but light transmittance decreases
Solution Approach 1:
The patent changes the optical parameters of copper-containing materials by using thin layers, transparent adhesives, or spaced discrete features rather than thick opaque coatings. This parameter change maintains antimicrobial effectiveness (which depends on copper presence, not opacity) while allowing high light transmittance for applications like smartphone screens or display surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The antimicrobial articles effectively kill at least 90-99% of targeted microorganisms and viruses within 120 minutes, are safe for handling, and can be applied to various surfaces with minimal environmental impact, offering flexibility and adaptability in design and application.
Implementation Method 1
electrolessly plated copper metal
Implementation Method 2
catalytic ink pattern
Data Source
AI summary
An intermediate article has a non-electrically conductive substrate having first and second opposing surfaces; and a catalytic ink disposed as a pattern of half-tone dots on at least the first opposing surface. Copper metal can be plated on the pattern of catalytic ink to provide a copper metal pattern that have antimicrobial properties. The resulting antimicrobial article can then be applied to various surfaces to mitigate the spread of infectious agents from one person to another.