Flexible Catheter Circuit Leaves for Compact Tip Assembly
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Solution Overview
Problem
The complexity and cost of manufacturing small form-factor electronic components for intravascular catheters are increased due to their small size, making it challenging to integrate and test electronic components effectively within the catheter tip.
Innovation Solution
A flexible electronic circuit design featuring a plurality of leaves with bonded proximal and distal sections and loose intermediate sections, equipped with conductive and test connector pads, allows for the integration of ultrasound transducer arrays and electronics packages, simplifying manufacturing and testing by reducing the need for complex vias and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If small form-factor electronic components are used in catheter tips, then the catheter size is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The flexible circuit is divided into multiple leaves that are bonded together in specific sections. The proximal section has leaves bonded in a stacked configuration, the intermediate section has leaves separated to form flying leads, and the distal section has leaves bonded to form a substrate. This segmentation allows each section to be optimized independently for its specific function.
Solution Approach 2:
The circuit transitions from a two-dimensional planar layout to a three-dimensional stacked configuration in the proximal section, then to separated flying leads in the intermediate section, and finally to a bonded substrate in the distal section. This dimensional transformation enables compact packaging while maintaining manufacturing feasibility.
2Volume of moving object
If small form-factor electronic components are used in catheter tips, then the catheter size is reduced, but manufacturing cost increases
Solution Approach 1:
The flexible circuit is divided into multiple leaves that are bonded together in specific sections. The proximal section has leaves bonded in a stacked configuration, the intermediate section has leaves separated to form flying leads, and the distal section has leaves bonded to form a substrate. This segmentation allows each section to be optimized independently for its specific function.
Solution Approach 2:
The circuit transitions from a two-dimensional planar layout to a three-dimensional stacked configuration in the proximal section, then to separated flying leads in the intermediate section, and finally to a bonded substrate in the distal section. This dimensional transformation enables compact packaging while maintaining manufacturing feasibility.
3Manufacturing precision
If complex vias and alignment are required for small components, then component integration is achieved, but manufacturing complexity increases
Solution Approach 1:
Alignment features such as holes and protrusions are pre-formed in the leaves during the bonding process. These preliminary alignment features guide the positioning of components and ensure proper alignment without requiring complex alignment procedures during assembly.
Solution Approach 2:
The flexible circuit leaves themselves serve as intermediaries that provide both electrical connectivity and mechanical alignment. The bonded leaves create a stable substrate that positions components relative to each other, eliminating the need for separate alignment mechanisms.
Data Source
AI summary
A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.


