Catheter Interposer Structure for Dense Routing and Tension Relief
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Solution Overview
Problem
Existing imaging catheter designs face challenges in efficiently interconnecting imaging components with electrical cables, particularly due to tension issues and limited space within the catheter.
Innovation Solution
The use of an interposer device with a multi-layered substrate structure, featuring conductive contact pads and patterned conductive lines, allows for wire-bonding of the imaging component and soldering of the electrical cable, providing dense and precise signal traces while maintaining a compact form factor suitable for catheter assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a separate flex circuit or PCB is used to interconnect the electrical cable and the imaging component, then tension on the imaging component is reduced, but the device becomes too large for the limited space within the imaging catheter
Solution Approach 1:
The patent merges the interconnection functions directly into the imaging component by providing a substrate with integrated contact pads and conductive traces. This eliminates the need for a separate flex circuit or PCB, thereby reducing the overall volume while maintaining the tension-relief function through the integrated design.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical connection through contact pads and traces, and tension relief capability. This multi-functionality eliminates the need for separate dedicated interconnection components, solving the space constraint problem.
2Device complexity
If direct connection or soldering of the electrical cable to the imaging component is used, then device complexity is reduced, but tension on the imaging component increases during catheter maneuvering
Solution Approach 1:
The patent segments the interconnection into distinct functional elements: contact pads for electrical connection, conductive traces for signal routing, and a substrate structure that provides mechanical compliance. This segmentation allows each element to be optimized for its specific function while working together to reduce tension on the imaging component.
Solution Approach 2:
The substrate acts as an intermediary between the electrical cable and the imaging component. It provides a compliant mechanical interface that absorbs tension and stress, preventing direct transmission of forces to the imaging component while maintaining reliable electrical connection.
3Ease of manufacture
If conventional PCB traces are used for signal routing, then manufacturing is simplified, but the trace density and precision are insufficient for high-resolution imaging catheters
Solution Approach 1:
The patent changes the fabrication parameters from conventional PCB standards to semiconductor-scale dimensions. The conductive traces are formed with widths of 1-10 micrometers and spacing of 1-5 micrometers, achieved through photolithography and etching processes. This parameter change enables high-density signal routing suitable for high-resolution imaging catheters.
Solution Approach 2:
The patent replaces conventional mechanical PCB fabrication methods with semiconductor manufacturing techniques. Photolithography, thin-film deposition, and precision etching processes are used to create the conductive trace pattern, enabling much higher precision and density than traditional PCB methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces tension on the imaging component, enables high-density signal routing, and maintains a compact size, making it suitable for use in imaging catheter assemblies.
Implementation Method 1
The top metal layer is plated with electroless nickel palladium immersion gold (ENEPIG) to from conductive contact pads
Implementation Method 2
The imaging component is wire-bonded to the interposer via a first subset of the conductive contact pads
Implementation Method 3
The electrical cable is soldered to the interposer via a second subset of the conductive contact pads
Data Source
AI summary
An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.