Basket Catheter Lead Attachment Using Laser Marking and Ultrasonic Bonding
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Solution Overview
Problem
The existing techniques for soldering leads to solder pads in expandable catheters, such as basket catheters, are time-consuming and prone to electrical shorts due to the high density of connections, making the process difficult and inefficient.
Innovation Solution
A system comprising a soldering fixture, a laser assembly for marking, a positioning assembly for precise alignment, and a processor with pattern recognition software to identify solder pads, along with an ultrasound transducer for ultrasonic attachment of leads to pads, which increases the distance between pads and automates the soldering process to prevent shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional soldering techniques are used to connect leads to solder pads in high-density catheter assemblies, then the number of connections can be increased, but the time required for soldering increases and the risk of electrical shorts increases
Solution Approach 1:
The patent replaces traditional mechanical soldering processes with ultrasonic welding technology. The ultrasonic welding device uses high-frequency mechanical vibrations to create bonds between leads and solder pads without requiring solder material, thereby eliminating the time-consuming heating and cooling cycles of traditional soldering while maintaining connection integrity in high-density configurations
Solution Approach 2:
The patent implements preliminary positioning and alignment mechanisms that pre-establish the correct spatial relationships between leads and solder pads before the actual bonding process. This preliminary action ensures precise registration and prevents misalignment issues that would require rework, thereby reducing total process time even as connection density increases
2Quantity of substance
If traditional soldering techniques are used to connect leads to solder pads in high-density catheter assemblies, then the number of connections can be increased, but the likelihood of electrical shorts increases
Solution Approach 1:
The patent replaces traditional soldering processes with ultrasonic welding technology. The ultrasonic welding device uses high-frequency mechanical vibrations to create bonds between leads and solder pads without requiring solder material, thereby eliminating the time-consuming heating and cooling cycles of traditional soldering while maintaining connection integrity in high-density configurations
Solution Approach 2:
The patent introduces a specialized ultrasonic welding device as an intermediary tool between the lead and solder pad. This device delivers controlled ultrasonic energy to create precise, localized bonds only at intended connection points, preventing stray solder flow or heat-affected zone expansion that could cause electrical shorts between adjacent connections
3Productivity
If the soldering process is performed manually or with simple automation, then the equipment complexity is low, but the productivity and precision of soldering connections are insufficient
Solution Approach 1:
The patent designs the ultrasonic welding device to perform multiple functions: positioning, alignment, bonding, and quality verification. By consolidating these functions into a single integrated system, the patent achieves high productivity without proportionally increasing overall system complexity, as the device replaces multiple separate tools and processes
Solution Approach 2:
The patent implements self-aligning features and automated control systems within the ultrasonic welding device that enable it to automatically adjust and optimize its operation. The system includes sensors and feedback mechanisms that allow the device to self-correct positioning errors and maintain optimal bonding parameters, reducing the need for complex external control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves the quality and productivity of soldering connections in catheters by reducing the likelihood of electrical shorts and simplifying the process, enhancing the automation and efficiency of lead attachment to solder pads.
Implementation Method 1
a laser assembly (77), which is configured to emit a laser beam (78), and to direct the laser beam toward the substrate of the spline
Implementation Method 2
The soldering gun comprises an ultrasound transducer, which is configured to ultrasonically attach the lead to the given solder pad at the soldering position by applying an ultrasound signal to the soldering position
Data Source
AI summary
A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.