Multielectrode Catheter Wire Soldering With Spring-Loaded Joining Tool
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Solution Overview
Problem
The challenge of soldering multiple wires to small pads on a circuit board in multielectrode catheters is complicated by the need for precise positioning and handling of wires with small diameters, leading to potential damage and difficulty in automating the process.
Innovation Solution
A soldering system using a joining tool with a spring and controller for a two-step process, involving preheating and softening tin domes with controlled electrical pulses, allows for simultaneous soldering of multiple wires to pads without damaging the wires or pads, utilizing a spring to compensate for height variations and control the force applied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pad size is scaled down to tens of microns to accommodate a large number of electrodes, then the density of electrodes can be increased, but the positioning precision and handling difficulty increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-forming tin domes on the pads before wire placement. This allows the wires to be positioned and soldered to precisely located tin domes, ensuring accurate alignment even with tens of micron pad sizes. The tin domes serve as pre-positioned targets that guide wire placement and ensure precise electrical connections.
Solution Approach 2:
The patent uses tin domes as an intermediary element between the pads and the wires. The tin domes are formed on the pads and serve as a mediator that facilitates precise wire-to-pad alignment. This intermediary structure makes it easier to achieve accurate positioning without directly manipulating the extremely small pads themselves.
2Productivity
If multiple wires are soldered simultaneously to improve productivity, then the manufacturing speed increases, but the control of wire positioning becomes difficult and wires may move from intended positions
Solution Approach 1:
The patent applies preliminary action by pre-forming tin domes on all pads before wire placement. This allows multiple wires to be positioned and soldered simultaneously because each wire has a predetermined target (the tin dome) to align with. The pre-formed tin domes act as positioning references that maintain wire accuracy even during simultaneous multi-wire soldering operations.
Solution Approach 2:
The patent replaces complex mechanical wire positioning and holding systems with a thermal field approach. By using pre-formed tin domes and controlled heating, the system achieves precise wire positioning without requiring complex mechanical clamping or alignment mechanisms that would be needed for simultaneous multi-wire soldering.
3Reliability
If a joining tool is used to press wires against pads for soldering, then the soldering quality improves, but the wires with small diameters are prone to damage
Solution Approach 1:
The patent applies parameter changes by controlling the temperature profile during soldering. Instead of using high mechanical pressure that could damage thin wires, the system uses controlled thermal parameters to melt the tin domes and create strong solder joints. The temperature is precisely controlled to ensure adequate solder flow and bonding while minimizing mechanical stress on the wires.
Solution Approach 2:
The patent applies beforehand cushioning by using the tin domes as a protective intermediary between the joining tool and the wires. The tin domes absorb and distribute the pressing force, preventing direct concentration of stress on the delicate wires. This cushioning effect protects the wires from damage while still ensuring adequate contact pressure for high-quality solder joints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables fast and accurate soldering of wires to pads, improving productivity and reducing costs by simplifying the process and avoiding the need for force sensors, while ensuring precise alignment and minimizing damage to the wires and pads.
Implementation Method 1
a spring (66), which is disposed between a movable stage (77) and the joining tool (55, 155), and is configured to press the joining tool (55, 155) against the wire (44) with an elastic force
Implementation Method 2
apply an electrical signal to the joining tool (55, 155) for heating the solder (33) and the wire (44)
Data Source
AI summary
A system includes: (I) a soldering assembly, including: (a) a joining tool, which is configured to: (i) press one or more wires against solder disposed over one or more pads, respectively, and (ii) heat the solder and the one or more wires; and (b) a spring, which is disposed between a movable stage and the joining tool, and is configured to press the joining tool against the one or more wires with an elastic force; and (II) a controller which is configured: (i) in a first step, to control a position of the movable stage relative to the joining tool for pressing the one or more wires against the solder, and (ii) in a second step, subsequent to the first step, to apply an electrical signal to the joining tool for heating the solder and the one or more wires and embedding the one or more wires in the solder.