Cationic Polymer Bonding for Thin Glass Carrier Debonding
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Solution Overview
Problem
Current technologies face challenges in processing thin glass sheets on glass carriers for high-temperature applications in display manufacturing, as existing methods fail to maintain sufficient bond strength during processing while allowing easy debonding post-processing, and suffer from outgassing issues.
Innovation Solution
The use of cationic polymers as surface modification layers on the thin sheets and carriers to achieve controlled bonding through van der Waals, hydrogen, and covalent interactions, allowing for strong bonding during high-temperature processing and easy debonding, while minimizing outgassing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used to bond thin glass sheets to carriers, then bond strength is sufficient for processing, but debonding becomes difficult after high-temperature processing
Solution Approach 1:
The patent applies parameter changes by using a self-assembled monolayer (SAM) with specific chemical composition and bonding characteristics that provide controlled adhesion. The SAM layer's chemical parameters are engineered to provide sufficient bond strength during processing while maintaining debondability after high-temperature treatment, resolving the contradiction between strong bonding and easy separation.
Solution Approach 2:
The self-assembled monolayer acts as an intermediary layer between the thin glass sheet and the carrier. This intermediate layer provides controlled bonding through its specific chemical properties, enabling the thin sheet to remain attached during processing while allowing for subsequent debonding, thus resolving the contradiction between maintaining bond strength and enabling easy separation.
2Reliability
If high-temperature processing is performed to fabricate TFT devices, then device performance is improved, but bond strength between thin sheet and carrier deteriorates
Solution Approach 1:
The SAM layer's chemical composition and bonding characteristics are specifically engineered to remain stable at high processing temperatures (up to 450°C or higher). The monolayer's thermal stability parameters are optimized to maintain bonding strength throughout TFT fabrication processes, enabling high-temperature device processing without bond failure.
3Adaptability or versatility
If polymer substrates are used for flexible displays, then flexibility and weight are improved, but temperature resistance and hermeticity deteriorate
Solution Approach 1:
The patent employs a composite structure combining a flexible polymer substrate with a self-assembled monolayer coating. This composite approach allows the underlying polymer to provide flexibility and light weight, while the SAM layer adds temperature resistance and improved surface properties, thereby resolving the contradiction between flexibility and temperature resistance.
4Temperature
If thin glass sheets are used instead of polymer substrates, then temperature resistance and chemical resistance are improved, but processing complexity increases
Solution Approach 1:
The self-assembled monolayer is formed on the thin glass sheet surface through a preliminary self-assembly process before device fabrication. This pre-formed layer simplifies subsequent processing by providing consistent bonding characteristics and surface properties, thereby reducing overall processing complexity while maintaining the temperature and chemical resistance benefits of thin glass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reuse of carriers by maintaining bond strength during TFT and LTPS processing up to 600°C and minimizing outgassing, ensuring the integrity of thin glass sheets and carriers.
Implementation Method 1
control both room-temperature van der Waals, and/or hydrogen bonding and/or electrostatic and high temperature covalent bonding between the thin sheet and carrier
Implementation Method 2
control both room-temperature van der Waals, and/or hydrogen bonding and/or electrostatic and high temperature covalent bonding between the thin sheet and carrier
Implementation Method 3
control both room-temperature van der Waals, and/or hydrogen bonding and/or electrostatic and high temperature covalent bonding between the thin sheet and carrier
Implementation Method 4
control both room-temperature van der Waals, and/or hydrogen bonding and/or electrostatic and high temperature covalent bonding between the thin sheet and carrier
Data Source
AI summary
Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.