Cavity-Base Bipolar Junction Transistor for Lower Base Resistance

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Solution Overview

Problem

Current bipolar junction transistor structures lack improved designs that enhance performance, particularly in terms of base resistance and high-frequency operation.

Innovation Solution

A structure for a bipolar junction transistor is developed, featuring a dielectric layer with a cavity, a first semiconductor layer, a collector, an emitter, and a second semiconductor layer with sections positioned laterally between the collector and emitter, utilizing a silicon-on-insulator substrate and epitaxial growth to reduce base resistance and improve high-frequency performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional bipolar junction transistor structures are used, then manufacturing is simpler, but base resistance is higher and high-frequency performance is degraded

Engineering Contradiction:
Improvehigh-frequency performanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The base region is extended vertically into the cavity beneath the collector, transitioning from a planar to a three-dimensional configuration. This vertical extension into the subsurface cavity reduces the lateral base width and associated resistance while maintaining adequate base-emitter and base-collector junction areas for proper transistor operation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The base region is nested within the cavity formed in the dielectric layer beneath the collector. This nested configuration allows the base to occupy the subsurface volume, effectively utilizing the space under the collector to reduce base resistance without increasing the device's lateral footprint or overall structural complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If the base width is reduced to lower base resistance, then high-frequency performance improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvebase resistanceVSAvoidbase width control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

By moving the base region into the vertical dimension (into the cavity), the effective lateral base width is reduced without requiring extremely precise lateral patterning. The base width in the lateral direction can be controlled with standard fabrication tolerances, while the vertical extent into the cavity provides the resistance reduction benefit.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure achieves reduced base resistance and enhanced high-frequency performance compared to conventional devices, with controlled base width and improved capacitance characteristics.

Implementation Method 1

utilizing a silicon-on-insulator substrate and epitaxial growth to reduce base resistance and improve high-frequency performance

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS11848374B2Bipolar junction transistors including a portion of a base layer inside a cavity in a dielectric layer
Publication Date: 2023.12.19 GLOBALFOUNDRIES US INC
  • US11848374B2 patent drawing
  • US11848374B2 patent drawing
  • US11848374B2 patent drawing

AI summary

Structures for a bipolar junction transistor and methods of forming a structure for a bipolar junction transistor. The structure includes a dielectric layer having a cavity, a first semiconductor layer on the dielectric layer, a collector including a portion on the first semiconductor layer, an emitter including a portion on the first semiconductor layer, and a second semiconductor layer that includes a first section in the cavity and a second section. The second section of the second semiconductor layer is laterally positioned between the portion of the collector and the portion of the emitter.