Cavity Bonding for Thermal Management in Electronic Mounting Boards
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Solution Overview
Problem
Sophisticated electronic devices generate more heat, leading to increased resistance in conductors due to heat transfer through the bond between the inorganic substrate and frame, causing signal voltage drops and potential malfunctions.
Innovation Solution
Incorporating cavities in the bond between the inorganic substrate and frame reduces heat transfer by minimizing the contact area, thereby reducing temperature changes and resistance variations in conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bond between the inorganic substrate and frame is made with large contact area to ensure mechanical strength, then the bonding strength is improved, but heat transfer increases causing resistance changes and signal voltage drops
Solution Approach 1:
The bond is segmented into multiple discrete bonding regions rather than a continuous large-area bond. This segmentation reduces the total heat transfer path while maintaining mechanical strength through distributed bonding points, resolving the contradiction between bonding strength and heat transfer control
Solution Approach 2:
Different regions of the bond are designed with different properties - some regions have larger contact area for mechanical strength while other regions have smaller contact area or are intentionally left unbonded to reduce heat transfer. This local differentiation allows simultaneous optimization of both bonding strength and thermal management
2Temperature
If the bond contact area is reduced to minimize heat transfer, then temperature changes are reduced, but bonding strength decreases
Solution Approach 1:
The bond contact area is segmented into multiple small bonding regions distributed across the interface. This segmentation reduces the continuous heat transfer path while maintaining adequate mechanical strength through the distributed bonding points, achieving both temperature stability and bonding strength
3Productivity
If sophisticated electronic devices with more functions are used to increase productivity, then device functionality is improved, but heat generation increases causing resistance changes and malfunctions
Solution Approach 1:
The bond structure acts as an intermediary between the heat-generating electronic device and the frame. By optimizing the bond contact area and distribution, it mediates the heat transfer process to prevent excessive temperature changes in the frame and conductors, thereby maintaining operational reliability while supporting high-functionality devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes heat transfer and resistance changes, reducing signal voltage drops and malfunctions in electronic packages, while maintaining intended electrical properties and airtightness.
Implementation Method 1
heat generated from an electronic device is mostly transferred to an inorganic substrate. The heat transferred to the inorganic substrate may be further transferred to the frame through the bond
Data Source
AI summary
An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.