Cavity Fan-Out Package Layout for High-Density I/O Miniaturization

The patent implements fan-out wiring that extends connections from the chip surface to the package exterior, utilizing three-dimensional spatial arrangement to achieve higher I/O density without increasing planar footprint. The redistribution layers are stacked in multiple tiers, transforming two-dimensional routing into three-dimensional pathways that resolve the contradiction between compact size and connection complexity.

The patent employs multiple redistribution layers nested within each other, with each layer containing conductive traces and vias that interconnect to form complex wiring patterns. These nested structures allow numerous I/O connections to be packed into a small volume by organizing conductors in hierarchical layers, effectively reducing package size while maintaining high functionality.

The fan-out package architecture redistributes I/O pads from a planar arrangement to a three-dimensional configuration using multiple redistribution layers stacked vertically. This allows the package to accommodate a high number of I/O connections without proportionally increasing the package footprint, as connections are routed through vertical vias and horizontal traces in multiple tiers.

The patent divides the wiring structure into multiple segmented redistribution layers, each handling specific portions of the I/O routing. This segmentation allows complex high-density interconnections to be organized into manageable layers, enabling functional density to increase while the package area remains controlled through efficient spatial utilization.