3D Interconnect Cavity Filling via Intracavity Partitioning
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Solution Overview
Problem
The challenge in integrated circuit fabrication is efficiently filling cavities of varying sizes in substrates with conductive materials while minimizing the range of overburden thickness, which is time-consuming and costly, leading to variations in device yields and non-planar surfaces.
Innovation Solution
The method involves placing an intracavity structure within the cavity to partition it into subcavities, which are then filled with a conductive material, using a barrier layer and seed layer for adhesion and growth, and subsequent planarization to remove excess material, thereby reducing overburden and improving filling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processes are used to fill cavities of varying sizes with conductive material, then complete filling of all cavities is achieved, but the overburden thickness varies dramatically and the process becomes time-consuming and costly
Solution Approach 1:
The cavity is divided into multiple subcavities by placing an intracavity structure (such as a partition wall or support structure) inside the cavity. This segmentation allows the conductive material to be deposited more efficiently, reducing the overburden thickness while ensuring complete filling of all subcavities. The partition structure creates smaller, more manageable spaces that can be filled uniformly without requiring excessive material deposition time.
2Manufacturing precision
If conventional processes are used to fill cavities of varying sizes with conductive material, then complete filling of all cavities is achieved, but the overburden thickness varies dramatically leading to non-planar surfaces
Solution Approach 1:
By partitioning the cavity into subcavities, the intracavity structure ensures that conductive material is distributed more uniformly across the cavity volume. This segmentation prevents the formation of large overburden variations that would result in non-planar surfaces, while still ensuring complete filling of all cavity regions.
Solution Approach 2:
The intracavity structure is placed within the cavity before the conductive material deposition process begins. This preliminary action creates a framework that guides the material deposition, ensuring uniform distribution and preventing excessive overburden formation that would compromise surface planarity.
3Manufacturing precision
If conventional processes are used to fill cavities of varying sizes with conductive material, then all cavities are filled, but the process becomes costly due to extensive planarization requirements
Solution Approach 1:
The cavity segmentation approach reduces the amount of excess conductive material that needs to be removed during planarization. By creating subcavities with the intracavity structure, the material deposition becomes more efficient and uniform, significantly reducing the cost associated with extensive planarization processes while ensuring complete cavity filling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and cost of filling cavities, enhances device yield, and achieves a more planar surface by partitioning cavities into subcavities for efficient conductive material deposition and planarization.
Implementation Method 1
The barrier layer 155 coats the insulating layer to ensure good adhesion and acts as a barrier material to prevent diffusion of conductive materials such as copper into the insulating layers and into semiconductor devices fabricated in the substrate 130
Implementation Method 2
selectively applying a plating process to deposit conductive substances on or within the cavities or vias
Implementation Method 3
a conventional process such as chemical-mechanical polishing/planarization (CMP) is employed to remove the excess conductive material that was deposited above the top surface of the substrate
Data Source
AI summary
The present invention discloses methods for depositing a material, particularly a conductive material, in cavities of a substrate and forming bonding contacts or pads thereon. An intracavity structure may be utilized in conjunction with embodiments of the present invention to provide efficient filling of diverse cavities within the substrate. Also provided are embodiments for interconnection structures using filled cavities, along with electrically conductive or reactive structures which may include capacitors fabricated within a substrate.