Cavity-Mounted Laser Chip Assembly for Precise Photonics Alignment
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Solution Overview
Problem
Aligning semiconductor lasers with edge couplers on photonics chips is challenging due to variations in chip thickness and the inability to control operating temperature, which affects heat dissipation and precision during the attachment process.
Innovation Solution
A structure comprising a photonics chip with a cavity-mounted laser chip and a lead frame, where the laser chip is inserted into a cavity in the photonics chip, and the lead frame provides mechanical and electrical connections, allowing for precise alignment and active cooling of the semiconductor laser.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bump connections are used to attach the laser chip to the photonics chip, then electrical connections are established, but alignment precision is limited due to variations in chip thickness and solder flow variability
Solution Approach 1:
The patent introduces a lead frame as an intermediary component between the laser chip and the photonics chip. The lead frame includes a first portion that attaches to the laser chip and a second portion that attaches to the photonics chip, serving as a mediator that facilitates both electrical connection and thermal management while simplifying the overall attachment process
Solution Approach 2:
The attachment structure is segmented into distinct functional components: the lead frame is divided into a first portion (attaching to laser chip) and a second portion (attaching to photonics chip), allowing each segment to be optimized for its specific function and enabling modular assembly
2Loss of energy
If the laser chip is attached using bump connections, then electrical connectivity is achieved, but heat dissipation capability is insufficient
Solution Approach 1:
The lead frame is designed to perform multiple functions simultaneously: it provides electrical connection between the laser chip and photonics chip, serves as a heat sink for thermal management, and acts as a mechanical support structure, thereby eliminating the need for separate components for each function
3Adaptability or versatility
If the laser chip thickness varies, then manufacturing flexibility is improved, but alignment precision with the edge coupler deteriorates
Solution Approach 1:
The lead frame is designed with flexible geometry that can accommodate variations in laser chip thickness. The first portion of the lead frame attaches to the laser chip in a manner that allows for thickness variations, providing a stable mounting surface that compensates for dimensional tolerances in the laser chip
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise alignment of the laser light with the edge coupler and effective heat dissipation, improving the efficiency and reliability of the photonics chip assembly by allowing active alignment and enhanced thermal management.
Implementation Method 1
The bump connections provide the primary conduction paths to sink heat generated during the operation of the laser chip
Implementation Method 2
The bump connections may include redistribution layers on the photonics chip and solder on the redistribution layers that is reflowed by a reflow process
Data Source
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AI summary
Structures including a photonics chip and a cavity-mounted laser chip, and methods of forming and using such structures. The structure comprises a photonics chip including a substrate and a cavity in the substrate. The structure further comprises a laser chip inside the cavity, and a lead frame comprising a first section attached to a portion of the laser chip and a second section attached to a portion of the photonics chip.