Cavity-Backed LED Module for Height Reduction
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Solution Overview
Problem
Existing light emitting device modules lack an efficient arrangement that optimizes luminous efficiency and reduces the overall height of lighting and display apparatuses, leading to increased volume and complexity.
Innovation Solution
A light emitting device module with a circuit board featuring cavities and a reflective layer, where light emitting device packages are electrically connected to lead frames and housed within these cavities, along with a light diffuser to enhance luminous efficiency and reduce height, and a backlight unit incorporating a light guide plate to diffuse light uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If light emitting device packages are mounted on a flat circuit board surface, then electrical connection is achieved, but the overall height and volume of the module increases
Solution Approach 1:
The patent implements cavities within the circuit board structure to nest the light emitting device packages. The packages are inserted into these recessed cavities, allowing them to be contained within the board's thickness rather than extending outward, thereby reducing the overall module height while maintaining proper electrical connections through lead frames that extend to the board surface.
Solution Approach 2:
The invention transitions from a two-dimensional mounting surface to a three-dimensional cavity structure. By creating recessed spaces within the circuit board, the design utilizes the vertical dimension to accommodate the light emitting devices, effectively reducing the horizontal footprint and overall module volume while maintaining functional performance.
2Volume of stationary object
If light emitting device packages are inserted into cavities, then volume is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies optimized parameter ranges for cavity depth (0.3mm to 0.7mm) and light diffuser height (1.3mm to 1.5mm) to achieve the balance between volume reduction and manufacturing feasibility. These carefully controlled dimensional parameters ensure that the cavities are deep enough to reduce module height but not so deep as to create excessive manufacturing difficulty or compromise light extraction efficiency.
Solution Approach 2:
The invention uses standardized cavity dimensions and configurations that can be replicated across multiple production units. By establishing consistent cavity geometries and depths, the design enables mass production with controlled precision requirements, reducing the impact of manufacturing variability on overall product performance.
3Illumination intensity
If reflective layers are added to cavity surfaces, then luminous efficiency is enhanced, but device complexity increases
Solution Approach 1:
The reflective layer is integrated directly into the cavity structure during circuit board fabrication, combining the lighting enhancement function with the structural component. This merging approach applies reflective coating to the cavity inner surfaces, eliminating the need for separate reflective elements and reducing overall device complexity while improving luminous efficiency by redirecting light that would otherwise be trapped.
Solution Approach 2:
The cavity structure serves multiple functions simultaneously: it provides mechanical support for the light emitting device package, enables volume reduction through nesting, and enhances luminous efficiency through integrated reflective surfaces. This multi-functionality reduces the need for additional components, thereby maintaining simplicity despite the performance enhancements.
4Length of moving object
If light diffusers are positioned close to packages, then height is reduced, but light distribution uniformity decreases
Solution Approach 1:
The patent positions the light diffuser at a specific optimized distance (1.6mm to 2.0mm from cavity bottom) to achieve local quality enhancement. This carefully controlled positioning ensures that the diffuser is close enough to maintain compact height but far enough to allow proper light distribution. The diffuser material properties are also optimized to compensate for the reduced distance, maintaining uniform light output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves reduced volume and enhanced luminous efficiency by optimizing the arrangement of light emitting device packages and light guide plates, resulting in improved light distribution and reduced space requirements in lighting and display applications.
Implementation Method 1
a reflective layer formed on a surface of each cavity
Implementation Method 2
a light diffuser disposed on the top of the package body
Implementation Method 3
a light guide plate to diffuse light introduced from the light emitting device module
Data Source
AI summary
Disclosed is a light emitting device module, which includes a circuit board having at least two cavities, a reflective layer formed on a surface of each cavity, and a light emitting device package disposed in each cavity. The light emitting device package includes a package body and a light emitting device disposed on the package body, the light emitting device being electrically connected to a first lead frame and a second lead frame.