Cavity-Embedded Optoelectronic Modules for Compact Integration
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Solution Overview
Problem
The integration of optoelectronic modules with optical filters into compact devices like smartphones is challenging due to limited space, as the height of these devices is typically only a few millimeters, making it difficult to accommodate optical and optoelectronic components effectively.
Innovation Solution
The design of optoelectronic modules with a semiconductor die that includes a cavity in its underside to house optoelectronic devices such as light sensors or emitters, reducing the overall height and enabling integration into space-constrained devices, utilizing a MEMS die with a Fabry-Perot interferometer tunable filter and a silicon substrate with etched cavities for accommodating these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional optoelectronic modules are used with flat semiconductor dies, then the optical filter functionality is achieved, but the overall module height becomes too large for integration into compact devices
Solution Approach 1:
The patent applies nesting by creating a cavity within the semiconductor die substrate and placing the optoelectronic device inside this cavity. This nested structure allows the optoelectronic device to be housed within the die itself rather than requiring external mounting space, thereby reducing the overall module height while maintaining proper component accommodation and optical functionality.
2Length of stationary object
If the semiconductor die is made thinner to reduce module height, then the z-height is reduced, but there is insufficient space to accommodate the optoelectronic device
Solution Approach 1:
The patent creates a cavity within the semiconductor die substrate that provides accommodation space for the optoelectronic device. This nested structure allows the device to be housed inside the die itself, effectively utilizing the die's internal volume rather than requiring additional external height, thus resolving the contradiction between thinness and accommodation space.
Solution Approach 2:
The patent transitions from a two-dimensional flat die structure to a three-dimensional structure by etching cavities into the die substrate. This dimensional change creates vertical accommodation space within the die thickness, allowing the optoelectronic device to be positioned in the z-dimension without increasing the overall module height.
3Device complexity
If the optoelectronic device is mounted on the flat surface of the die, then the assembly is simple, but the module height increases beyond acceptable limits
Solution Approach 1:
The patent nests the optoelectronic device within a cavity formed in the semiconductor die substrate. This approach maintains relative assembly simplicity while dramatically reducing module height, as the device is integrated into the die structure rather than being mounted on its external surface.
Solution Approach 2:
The patent merges the semiconductor die substrate with the optoelectronic device housing by forming the cavity directly in the die. This consolidation integrates two previously separate functions (the die as a mounting platform and the housing as a container) into a single unified structure, reducing overall complexity and height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the reduction of the module's z-height, facilitating integration into small devices while maintaining the functionality of the optoelectronic components, reducing the number of processing steps, and minimizing stray light, with the potential for wafer-level processing and improved optical transmission.
Implementation Method 1
A FPI is based on two mirrors, whereby a Fabry-Perot cavity is formed in a gap between the mirrors. The pass band wavelength of the FPI is controlled by adjusting the distance between the mirrors
Implementation Method 2
A Fabry-Perot interferometer (FPI), for example, can be used as an optical filter. A FPI is based on two mirrors, whereby a Fabry-Perot cavity is formed in a gap between the mirrors
Data Source
AI summary
An optoelectronic module includes an optical filter and can have a relatively small overall height. The module includes a semiconductor die for the optical filter, where the die has a cavity in its underside. The cavity provides space to accommodate an optoelectronic device such as a light sensor or light emitter. Such an arrangement can reduce the overall height of the module, thereby facilitating its integration into a host device in which space is at a premium.