Cavity Package Structure With Barring Layer for Adhesive Overflow
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Solution Overview
Problem
Open cavity mold packages for IC packaging face challenges such as increased manufacturing complexity, cost, and reduced device density due to the need for delicate mold tools and potential package size increase.
Innovation Solution
A package structure comprising laminated substrates that define a cavity, with a chip encapsulated by an encapsulant and an adhesive element spaced apart from the encapsulant by a barring structure, eliminating the need for mold tools and allowing for reduced package size and increased device density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If open cavity mold packages are used for IC packaging, then the package structure can be formed, but the manufacturing complexity and cost increase due to delicate mold tools
Solution Approach 1:
The patent extracts and eliminates the mold tool component from the packaging system by using a moldless packaging approach where the encapsulant is applied directly to the substrate without requiring delicate mold tools, thereby reducing manufacturing complexity and device complexity simultaneously
Solution Approach 2:
The patent replaces expensive, delicate mold tools with a disposable or reusable encapsulant material that can be directly applied to the substrate, eliminating the need for complex mold tooling infrastructure and reducing both manufacturing complexity and device complexity
2Productivity
If open cavity mold packages are used, then the package structure can be formed, but the package size increases and device density decreases
Solution Approach 1:
The patent removes the mold structure from the package design, eliminating the additional space required for mold tooling and associated features, thereby reducing package size and increasing device density
Solution Approach 2:
Instead of using a mold to form the package structure from the outside in, the patent applies the encapsulant directly to the substrate from the inside out, inverting the traditional packaging approach and achieving more compact package dimensions with higher device density
3Reliability
If adhesive element is placed directly over the substrate without barring structure, then the structure is simpler, but adhesive contact and overflow issues occur reducing reliability
Solution Approach 1:
The patent introduces a barring structure as an intermediary element between the adhesive element and the encapsulant, preventing direct contact between these two materials and eliminating adhesive overflow issues while maintaining structural simplicity and improving reliability
Solution Approach 2:
The patent segments the substrate structure by adding a barring structure that divides the space between the adhesive element and encapsulant, creating distinct functional zones that prevent material interaction and improve adhesive contact stability without significantly increasing overall device complexity
Data Source
AI summary
A package structure is provided. The package structure includes a substrate structure, a chip, an encapsulant, and an adhesive element. The substrate structure defines a cavity. The chip is disposed in the cavity. The encapsulant encapsulates the chip. The adhesive element is disposed over a top surface of the substrate structure, wherein the substrate structure includes a barring structure between the encapsulant and the adhesive element and configured to reduce a contact between the encapsulant and the adhesive element.