Cavity Semiconductor Package Layout for Thermal Reliability
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device design featuring a substrate with a base and leads, where an encapsulant is interposed between the leads, and an electronic component is coupled to the cavity side, spaced apart from the encapsulant, allowing for improved thermal performance and reduced package size through selective etching and molding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and cost is excessive
Solution Approach 1:
The electronic component is nested within a cavity formed in the substrate, with the encapsulant material filling and protecting the component. This nesting approach reduces the overall package volume by integrating the component into the substrate structure rather than mounting it externally, directly addressing the contradiction between compact size and manufacturing feasibility.
Solution Approach 2:
The invention transitions from traditional planar package layouts to a three-dimensional structure by forming a cavity within the substrate and positioning the electronic component vertically within this cavity. This dimensional change enables smaller footprint and volume while maintaining manufacturing simplicity through standard semiconductor fabrication processes.
2Reliability
If conventional semiconductor packages are used, then manufacturing process is traditional, but reliability is decreased
Solution Approach 1:
The substrate and encapsulant are merged into an integrated structure where the encapsulant is formed as part of the substrate fabrication process. The cavity is formed within the substrate itself, and the encapsulant material is deposited to seal and protect the electronic component. This merging eliminates separate assembly steps, improving reliability through better integration while maintaining ease of manufacture through consolidated processing.
Solution Approach 2:
The cavity is formed in the substrate before the electronic component is installed, and the encapsulant is applied in advance to seal the component within the cavity. This preliminary structuring of the package architecture enables subsequent component placement and sealing to be performed more reliably, improving overall package reliability without significantly complicating the manufacturing process.
3Temperature
If conventional semiconductor packages are used, then structure is traditional, but thermal performance is insufficient
Solution Approach 1:
The substrate is designed with a cavity that provides direct thermal pathways from the electronic component to heat sinks or thermal management structures. The encapsulant material is selectively applied to protect the component while maintaining thermal conductivity in critical regions. This local optimization of structural quality enables superior thermal performance without requiring complete redesign of the entire package structure.
Data Source
AI summary
In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.