Cavity-Forming Polymer Composition for Low-Capacitance Wiring
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Solution Overview
Problem
Existing methods for reducing parasitic capacitance between wires in semiconductor elements, such as O2 plasma treatment and sacrificial material layer removal, face limitations in material restrictions and cost inefficiencies, and decomposition ratios are not satisfactory.
Innovation Solution
A cavity forming composition containing an addition polymer with specific repeating units having a thermosetting moiety and an easily thermally decomposable moiety, allowing for the formation of cavities between conductive wiring patterns through heating, which includes a solvent and two or more types of monomers with ethylenically unsaturated bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If O2 plasma treatment is used to remove the organic resin film, then the organic resin film can be removed and the second insulating film becomes sparse, but the material of the second insulating film is largely restricted and expensive apparatus is required
Solution Approach 1:
The patent replaces the O2 plasma treatment process with a thermal decomposition process. Instead of using plasma (a form of electromagnetic energy treatment), the invention uses heat to decompose and remove the organic resin film. This substitution allows any thermally stable insulating film material to be used as the second insulating film, removing the material restrictions imposed by plasma treatment requirements.
Solution Approach 2:
The invention changes the processing parameter from plasma exposure to temperature control. By heating the substrate to a specific temperature range, the organic resin film decomposes and removes while leaving the inorganic second insulating film intact. This parameter change enables broader material compatibility and eliminates the need for specialized plasma apparatus.
2Ease of manufacture
If O2 plasma treatment is used to remove the organic resin film, then the organic resin film can be removed, but expensive apparatus is required
Solution Approach 1:
The patent replaces the complex plasma treatment apparatus with a simple heating apparatus. Instead of requiring plasma generation equipment, the invention uses conventional heating devices to achieve film removal through thermal decomposition, significantly reducing apparatus complexity and cost.
3Manufacturing precision
If a sacrificial material layer containing crosslinked polymer is used to form air gaps, then cavities can be formed between wires, but the decomposition ratio by baking is not necessarily satisfactory
Solution Approach 1:
The invention changes the chemical composition parameters of the sacrificial material by using a copolymer with specific repeating units that have low decomposition temperatures. This parameter change ensures complete decomposition at the baking temperature used for cavity formation, achieving both precise cavity formation and complete material removal without residue.
Solution Approach 2:
The patent uses a copolymer composed of multiple types of repeating units with different properties. The first repeating units provide structural integrity during processing, while the second repeating units ensure complete decomposition at the baking step. This composite material approach solves the contradiction between maintaining structural integrity and achieving complete decomposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of a uniform insulating layer with high glass transition temperature and high decomposition ratio, effectively reducing parasitic capacitance by forming cavities between wiring patterns, thus improving signal integrity in semiconductor elements.
Implementation Method 1
a thermal decomposition temperature of the easily thermally decomposable moiety is higher than a thermally curing temperature of the thermosetting moiety
Implementation Method 2
a repeating unit (R1) having a thermosetting moiety and a repeating unit (R2) having an easily thermally decomposable moiety
Data Source
AI summary
A cavity forming composition for forming a cavity between conductive wiring patterns on a semiconductor substrate, the cavity forming composition containing: a solvent; and an addition polymer formed of two or more types of monomers having an ethylenically unsaturated bond, wherein the addition polymer has a repeating unit (R1) having a thermosetting moiety and a repeating unit (R2) having an easily thermally decomposable moiety, and a thermal decomposition temperature of the easily thermally decomposable moiety is higher than a thermally curing temperature of the thermosetting moiety.