Cavity-Forming Polymer Composition for Low-Residue Wiring Gaps
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Solution Overview
Problem
Existing methods for forming cavities between conductive wiring patterns on semiconductor substrates, such as those described in Patent Literatures 1 and 2, face limitations in material restrictions, apparatus requirements, and residue issues that affect electrical characteristics, particularly when using thermal decomposition.
Innovation Solution
A cavity forming composition comprising a polymer with an alicyclic hydrocarbon structure in its main chain, free from aromatic hydrocarbons, is used to form a cavity between conductive wiring patterns, which is thermally decomposable with minimal residue, and includes a solvent and optionally an acid catalyst.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If O2 plasma treatment is used to remove the organic resin film, then the organic resin film can be effectively removed, but the material of the second insulating film is largely restricted and expensive apparatus is required
Solution Approach 1:
The patent replaces the O2 plasma treatment method with a thermal decomposition method using a heating apparatus. This substitution eliminates the need for expensive plasma equipment and expands material compatibility, as the heating method can process various insulating film materials without the strict oxygen environment requirements of plasma treatment.
Solution Approach 2:
The patent employs a disposable organic resin film that is intentionally designed to be thermally decomposable. This resin film serves as a temporary sacrificial layer that can be completely removed by heating, eliminating the need for complex removal processes and expensive equipment while maintaining effective cavity formation.
2Reliability
If O2 plasma treatment is used to remove the organic resin film, then the organic resin film can be effectively removed, but expensive apparatus is required
Solution Approach 1:
The patent replaces the expensive O2 plasma treatment apparatus with a simple heating apparatus. This substitution dramatically reduces manufacturing equipment costs while maintaining effective organic resin film removal through thermal decomposition, making the process more economically viable for semiconductor manufacturing.
Solution Approach 2:
The patent uses a disposable organic resin film designed for thermal decomposition. This approach eliminates the need for expensive plasma equipment by utilizing a simple heating process that can completely remove the sacrificial resin layer, significantly reducing capital equipment investment and manufacturing costs.
3Ease of manufacture
If a thermally decomposable polymer is used to form a cavity by heating, then the cavity can be formed without plasma apparatus, but the polymer produces residue that affects electrical characteristics
Solution Approach 1:
The patent modifies the chemical composition parameters of the polymer by specifying that it must contain an alicyclic hydrocarbon structural moiety and not contain an aromatic hydrocarbon structural moiety in its main chain. This parameter change ensures complete thermal decomposition without residue formation, eliminating electrical characteristic degradation while maintaining the manufacturing simplicity of the heating method.
Solution Approach 2:
The patent employs a specifically designed composite polymer material with alicyclic hydrocarbon structure that combines ease of thermal decomposition with complete residue-free breakdown. This specialized material composition allows the polymer to serve both as a structurally sound cavity-forming layer and as a completely removable sacrificial material that leaves no harmful residues.
4Productivity
If wiring is miniaturized to achieve high integration, then the semiconductor element becomes highly integrated, but parasitic capacitance between wires increases
Solution Approach 1:
The patent applies segmentation by completely removing the organic resin film to create discrete, isolated cavities between adjacent conductive wiring patterns. This complete removal and cavity formation physically separates the wiring patterns, reducing their electromagnetic coupling and parasitic capacitance while maintaining the high integration density achieved through miniaturization.
Solution Approach 2:
The patent creates a porous or cavity-containing insulating film structure by completely removing the organic resin film. These cavities reduce the dielectric constant of the insulating material, thereby reducing parasitic capacitance between adjacent wires while maintaining the physical proximity required for high integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of a uniform insulating layer with high thermal decomposability, minimizing residue and enhancing electrical characteristics by effectively forming cavities between wiring patterns.
Implementation Method 1
a cavity forming composition for forming a cavity between conductive wiring patterns on a semiconductor substrate, the cavity forming composition containing: a polymer containing an alicyclic hydrocarbon structural moiety and not containing an aromatic hydrocarbon structural moiety
Implementation Method 2
a step (D) of heating the semiconductor substrate to burn out the cavity forming film after the step (C)
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
Provided are a cavity forming composition suitable for forming a cavity by heating between conductive wiring patterns on a semiconductor substrate, and the like. A cavity forming composition for forming a cavity between conductive wiring patterns on a semiconductor substrate, the cavity forming composition containing: a polymer containing an alicyclic hydrocarbon structural moiety and not containing an aromatic hydrocarbon structural moiety; and a solvent.