Cavity Packaging Structure for RF Signal Shielding and Chip Protection
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Solution Overview
Problem
Current chip package structures with integrated antenna structures face challenges in protecting the electronic devices effectively and reducing signal divergence during radio frequency transmission, often resulting in larger sizes.
Innovation Solution
An electronic packaging structure is designed with a first circuit structure featuring a cavity on its bottom side, covered with a conductive material, and incorporating a coaxial conductive via for electrical grounding and signal connection, along with a second circuit structure that houses an electronic device within the cavity, connected via conductive connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip is covered by a film sealing material to form the chip package structure, then the chip is protected, but the electronic device is difficult to be protected well and the package size becomes larger
Solution Approach 1:
The patent implements nesting by placing the electronic device (chip) inside a cavity formed in the circuit board, rather than covering it with a film sealing material. The cavity is defined by recesses in the circuit board layers, creating a protected enclosure that integrates the chip within the board structure itself, eliminating the need for additional sealing films and reducing overall package size.
2Reliability
If the antenna structure is disposed on the chip package structure with conductive pillar or conductive ball, then electrical connection is achieved, but signal divergence is not reduced effectively and the structure becomes larger
Solution Approach 1:
The patent merges the antenna structure with the circuit board by forming conductive patterns directly on the board layers. The circuit board serves dual functions as both the mounting substrate and the antenna structure, eliminating the need for separate conductive pillars or balls and reducing signal divergence through integrated geometry.
Solution Approach 2:
The circuit board is designed to serve multiple functions simultaneously: it provides mechanical support, electrical connections, and acts as the antenna structure itself. The same board layers that carry circuit traces also form the radiating elements of the antenna, reducing the need for additional components and minimizing package size.
3Ease of manufacture
If conventional chip package structure is used, then manufacturing is simplified, but signal interference increases and protection is insufficient
Solution Approach 1:
The patent segments the circuit board into multiple layers with distinct functions. Conductive layers are separated by dielectric layers, creating a stratified structure where signal paths are isolated from interfering elements. The cavity structure further segments the space to contain electromagnetic fields and reduce interference with external components.
Data Source
AI summary
An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.