Cavity Semiconductor Packaging With Redistribution for Compact Reliability
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor structure and manufacturing method involving a redistribution structure with a conductive structure, a cavity substrate, an electronic component, and an encapsulant, where the electronic component is electrically coupled with the conductive structure, and the encapsulant contacts both the electronic component and the pillar, providing protection and electrical coupling while optimizing package size and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is excessive and reliability is decreased
Solution Approach 1:
The semiconductor package is divided into distinct functional segments: a substrate layer, a cavity structure, an encapsulant layer, and a redistribution structure. This segmentation allows each component to be optimized independently for reliability while maintaining manufacturing feasibility through modular assembly processes.
Solution Approach 2:
The invention transitions from conventional planar package structures to a three-dimensional architecture incorporating vertical cavities and multi-layer redistribution paths. This dimensional change enables improved signal integrity and reliability while managing complexity through structured layering rather than planar expansion.
2Volume of moving object
If conventional semiconductor packages are used, then manufacturing process is simpler, but package size is too large
Solution Approach 1:
The encapsulant is nested within the cavity structure, which is itself integrated into the substrate. The redistribution structure is then nested within the encapsulant layer. This nested arrangement minimizes package volume by utilizing vertical space efficiently while maintaining a systematic manufacturing approach through sequential layer formation.
Solution Approach 2:
The package architecture moves from two-dimensional planar layouts to three-dimensional vertical stacking with cavities extending through the substrate thickness. This enables compact footprint while organizing manufacturing complexity into discrete vertical layers that can be processed sequentially.
3Reliability
If conventional semiconductor packages are used, then structure is simpler, but performance is relatively low
Solution Approach 1:
The redistribution structure is selectively positioned in specific regions of the package to optimize signal routing where needed, rather than uniformly across the entire package. The cavity structure is strategically located to provide mechanical support and electrical isolation at critical interfaces, enhancing performance without unnecessary complexity throughout the entire structure.
Solution Approach 2:
The encapsulant serves multiple functions simultaneously: it provides mechanical protection, electrical insulation, and structural support for the redistribution structure. The cavity structure likewise provides both mechanical reinforcement and electrical isolation functions, reducing the need for separate dedicated components and optimizing performance through multi-functional design.
Data Source
AI summary
In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.